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Electronic materials innovations and reliability in advanced memory packaging

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Electronic materials innovations and reliability in advanced memory packaging/ by Chong Leong Gan, Chen Yu Huang.
作者:	Gan, Chong Leong.
其他作者:	Huang, Chen-Yu.
出版者:	Cham :Springer Nature Switzerland : : 2025.,
面頁冊數:	xv, 178 p. :ill. (some col.), digital ; : 24 cm.;
Contained By:	Springer Nature eBook
標題:	Industrial and Production Engineering. -
電子資源:	https://doi.org/10.1007/978-3-031-94795-7
ISBN:	9783031947957

Electronic materials innovations and reliability in advanced memory packaging
Gan, Chong Leong.

Electronic materials innovations and reliability in advanced memory packaging[electronic resource] /by Chong Leong Gan, Chen Yu Huang. - Cham :Springer Nature Switzerland :2025. - xv, 178 p. :ill. (some col.), digital ;24 cm. - Springer series in reliability engineering,2196-999X. - Springer series in reliability engineering..

Influences of Electronic Materials Properties on Packaging Reliability -- Mechanical and Thermal Stress of Encapsulant and New Materials in Memory Packaging -- Materials Development for Future Data Center Applications -- Advanced Chiplets and Heterogenous Integration in Memory Device Packaging -- Hybrid Bonding Device Packaging -- Hardware Reliability for Memory Modules and SSDs -- Innovative Sustainable Electronics Materials in Advanced Memory Packaging -- PCB and Substrate in Future Memory Applications.

This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.

ISBN: 9783031947957

Standard No.: 10.1007/978-3-031-94795-7doiSubjects--Topical Terms:

593943
Industrial and Production Engineering.

LC Class. No.: TK7870.15

Dewey Class. No.: 621.381046

Electronic materials innovations and reliability in advanced memory packaging
LDR:02199nam a2200361 a 4500 001 1166648
003 DE-He213
005 20250721130933.0
006 m d
007 cr nn 008maaau
008 251217s2025 sz s 0 eng d
020 $a 9783031947957 $q (electronic bk.)
020 $a 9783031947940 $q (paper)
024 7 $a 10.1007/978-3-031-94795-7 $2 doi
035 $a 978-3-031-94795-7
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7870.15
072 7 $a PN $2 bicssc
072 7 $a TGM $2 bicssc
072 7 $a SCI013000 $2 bisacsh
072 7 $a PN $2 thema
072 7 $a TGMM $2 thema
082 0 4 $a 621.381046 $2 23
090 $a TK7870.15 $b .G195 2025
100 1 $a Gan, Chong Leong. $3 1495481
245 1 0 $a Electronic materials innovations and reliability in advanced memory packaging $h [electronic resource] / $c by Chong Leong Gan, Chen Yu Huang.
260 $a Cham : $c 2025. $b Springer Nature Switzerland : $b Imprint: Springer,
300 $a xv, 178 p. : $b ill. (some col.), digital ; $c 24 cm.
490 1 $a Springer series in reliability engineering, $x 2196-999X
505 0 $a Influences of Electronic Materials Properties on Packaging Reliability -- Mechanical and Thermal Stress of Encapsulant and New Materials in Memory Packaging -- Materials Development for Future Data Center Applications -- Advanced Chiplets and Heterogenous Integration in Memory Device Packaging -- Hybrid Bonding Device Packaging -- Hardware Reliability for Memory Modules and SSDs -- Innovative Sustainable Electronics Materials in Advanced Memory Packaging -- PCB and Substrate in Future Memory Applications.
520 $a This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
650 2 4 $a Industrial and Production Engineering. $3 593943
650 2 4 $a Materials Engineering. $3 1062318
650 2 4 $a Electronics Design and Verification. $3 1387809
650 2 4 $a Electronic Circuits and Systems. $3 1366689
650 1 4 $a Electronic Materials. $3 1389371
650 0 $a Electronic packaging $x Materials. $3 563355
700 1 $a Huang, Chen-Yu. $3 1495482
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer Nature eBook
830 0 $a Springer series in reliability engineering. $3 632430
856 4 0 $u https://doi.org/10.1007/978-3-031-94795-7
950 $a Chemistry and Materials Science (SpringerNature-11644)