陳文瑞

Overview

Works:	1 works in 31 publications in 1 languages

Titles

高功率表面黏著型發光二極體封裝製程與特性量測 = The packing process and characterization of measurement for high power surface-mount light-emitting diode by: Meen Teen-Hang; 閔庭輝; 游元慶; Chen Wen-Ray Chen; Yu Yuan-Ching; 陳文瑞; 國立虎尾科技大學 (Language materials, printed)

介質導熱固化層應用於照明模組之研究 = The Study of Lighting Module by Applying the Conductive and Cured Dielectric Layer by: Wen-Ray Chen; 陳文瑞; 林政傑; Cheng-Chieh Lin (Language materials, printed)

應用電泳連續製程技術於高功率白光發光二極體之開發 = Development of high power white LEDs by adopting the continuously electrophoretic process technique by: Wen-Ray Chen; 陳文瑞; 楊程宇; Chen-Yu Yang (Language materials, printed)

高功率發光二極體路燈之光學設計與開發 = The Optical Design and Development for High Power LED Street Lights. by: 陳文瑞; Wen-Ray Chen; Pi-Hsia Hsieh; 謝碧霞 (Language materials, printed)

氮化鋁薄膜用於高功率發光二極體散熱研究 = Study of AlN Thin Films for High-Power Light Emitting diode by High Heat Conduction Layer by: 陳文瑞; Wen-Ray Chen; 彭正宏; Cheng Hung Peng (Language materials, printed)

應用鋁鍺共晶於發光二極體覆晶封裝之研究 = The Study of Flip Chip Packaging Technique on LEDs by Applying the Al-Ge Eutectic by: Wen-Ray Chen; 陳文瑞; 廖冠翔; Guan-Xiang Liao (Language materials, printed)

氮化鋁鎵/氮化鎵高電子遷移率電晶體之製作與研究 = Fabrication and study of algan/gan high electron mobility transistor by: 林義, {E5B3AF}; Yi-Feng Lin; 陳文瑞 (Language materials, printed)

應用鋁鍺共晶於高功率交流發光二極體覆晶封裝之研究 = The Study of Flip Chip Packaging Technique on AC-Drived High Power LEDs by Al-Ge Bonding by: Zheng-Feng Liao; 廖政峰; 陳文瑞; Wen-Ray Chen (Language materials, printed)

應用矽副載具於高功率發光二極體覆晶封裝技術之研究 = Study of flip chip packaging technique on high power LEDs by adopting silicon submount by: 莊顏聞; Wen-Ray Chen; 陳文瑞; Yan-Wun Jhuang (Language materials, printed)

具濾波與靜電防護基板應用於交流發光二極體封裝之研究 = study of rectifying and electrostatic discharge protection substrate applied on AC light-emitting diodes package by: Yong-Yi Liao; 廖永羿; 陳文瑞; Wen-Ray Chen (Language materials, printed)

Subjects

Si-submount white LED LED light bulb self-package Dialux照明方案設計軟體 Sputtering gun 筒燈 PWM Dimmer light-guide plate Indoor Lighting AC LED 矽基板 Submount 覆晶封裝 AlN film 串聯電阻熱阻 Lav Heat sink eutectic Al-Ge 色溫太陽電池靜電防護 Eav 氮化鋁 Temperature 濾波電容 thermal resistance CCFL light source 光感測器高電子遷移率電晶體 Light Guide Plate SiC CCFL發光源 AC-LED Shear strength Al backlight module T1 junction temperature yellow halo U0 室內照明 photovoltaic 副載具 CdS/GaAs GaN series resistance LED light source 平均亮度(Lav) Heat conduction material DEPENDENCE VERIFICATION 透鏡底部填膠碳化矽信賴性 PWM調光散熱材 Reflector Thermal resistance 最佳化 under fill LED simulation 縱向均勻度(UL) 濺鍍槍副載置片 electrophoretic micro structure 光衰金錫合金矽膠 Flip Chip Light Decay AlN High Electron Mobility Transistor indoor lighting 剪力強度 candela distribution plot reverse micelle method rectifying capacitor 背光模組 magnetic core-shell nanoparticles 紫外光 UE 封裝製程眩光(T1) 網版印刷 Down Light 磁性核殼型奈米粒子 solar cells concentrator solar cells 平均照度(Eav) ESD protection 亮度均勻度(U0) 導熱材 direct type backlight module 黃暈 Flip-Chip 側部式背光模組氮化鋁薄膜 High-power LED streetlight The packing process and characterization of meas 鋁鍺共晶鑽石薄膜發光二極體球泡燈光學分析接面溫度 Si 溫度 DLC film color temperature Heat sinkLED 硫化鎘氮化銦鎵 Al-Ge 鋁 InGaN Optimization Design 交流發光二極體 TemperatureLight Decay Au-Sn alloy 氮化鎵二次光學透鏡高功率LED路燈主動封裝照度均勻度(UE) Backlight module 可靠度驗證 UL photodetector 配光曲線 optic lens 聚光型太陽能電池 BACKLIGHT MODULE edge-type backlight module UV Flip-chip LED發光源 light emitting diodes (LEDs) 菲涅爾透鏡 Dialux Screen printing 反射杯逆微胞法微結構直下式背光模組矽 light guide LED 電泳 LENS Fresnel lens Direct-type LED BLM silicone 發光二極體模擬 LEDs 白光LED 導光板