Languages
Radojcic, Riko.
Overview
| Works: | 8 works in 1 publications in 1 languages | |
|---|---|---|
Titles
More-than-Moore 2.5D and 3D SiP integration
by:
SpringerLink (Online service); Radojcic, Riko.
(Language materials, printed)
Three dimensional system integration = IC stacking process and design /
by:
SpringerLink (Online service); Radojcic, Riko.; Papanikolaou, Antonis.; Soudris, Dimitrios.
(Language materials, printed)
Managing More-than-Moore Integration Technology Development = A Story of an Advanced Technology Program in the Semiconductor Industry /
by:
Radojcic, Riko.; SpringerLink (Online service)
(Language materials, printed)
, [http://id.loc.gov/vocabulary/relators/aut]
Subjects
Electronic Circuits and Devices.
Engineering—Vocational guidance.
Circuits and Systems.
Basics of Construction.
Systems integration.
Architecture.
Embedded computer systems.
Engineering economics.
Engineering economy.
Job Careers in Science and Engineering.
Engineering.
Electronic circuits.
Engineering Economics, Organization, Logistics, Marketing.
Integrated circuit layout.
Processor Architectures.