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Three dimensional system integration...
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SpringerLink (Online service)
Three dimensional system integration = IC stacking process and design /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Three dimensional system integration/ edited by Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic.
Reminder of title:
IC stacking process and design /
other author:
Papanikolaou, Antonis.
Published:
Boston, MA :Springer Science+Business Media, LLC, : 2011.,
Description:
viii, 246 p. :ill., digital ; : 24 cm.;
Contained By:
Springer eBooks
Subject:
Integrated circuit layout. -
Online resource:
http://dx.doi.org/10.1007/978-1-4419-0962-6
ISBN:
9781441909626 (electronic bk.)
Three dimensional system integration = IC stacking process and design /
Three dimensional system integration
IC stacking process and design /[electronic resource] :edited by Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic. - Boston, MA :Springer Science+Business Media, LLC,2011. - viii, 246 p. :ill., digital ;24 cm.
ISBN: 9781441909626 (electronic bk.)Subjects--Topical Terms:
671125
Integrated circuit layout.
LC Class. No.: TK7874.55 / .T47 2011
Dewey Class. No.: 621.3815
Three dimensional system integration = IC stacking process and design /
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IC stacking process and design /
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edited by Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic.
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Engineering (Springer-11647)
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