國立虎尾科技大學 |

Modeling and Application of Flexible Electronics Packaging

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Modeling and Application of Flexible Electronics Packaging/ by YongAn Huang, Zhouping Yin, Xiaodong Wan.
作者:	Huang, YongAn.
其他作者:	Yin, Zhouping.
面頁冊數:	XVII, 287 p.online resource. :
Contained By:	Springer Nature eBook
標題:	Electronics. -
電子資源:	https://doi.org/10.1007/978-981-13-3627-0
ISBN:	9789811336270

Modeling and Application of Flexible Electronics Packaging
Huang, YongAn.

Modeling and Application of Flexible Electronics Packaging[electronic resource] /by YongAn Huang, Zhouping Yin, Xiaodong Wan. - 1st ed. 2019. - XVII, 287 p.online resource.

Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

ISBN: 9789811336270

Standard No.: 10.1007/978-981-13-3627-0doiSubjects--Topical Terms:

596389
Electronics.

LC Class. No.: TK7800-8360

Dewey Class. No.: 621.381

Modeling and Application of Flexible Electronics Packaging
LDR:02139nam a22003975i 4500 001 1009158
003 DE-He213
005 20200629231200.0
007 cr nn 008mamaa
008 210106s2019 si | s |||| 0|eng d
020 $a 9789811336270 $9 978-981-13-3627-0
024 7 $a 10.1007/978-981-13-3627-0 $2 doi
035 $a 978-981-13-3627-0
050 4 $a TK7800-8360
050 4 $a TK7874-7874.9
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TJF $2 thema
082 0 4 $a 621.381 $2 23
100 1 $a Huang, YongAn. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1199865
245 1 0 $a Modeling and Application of Flexible Electronics Packaging $h [electronic resource] / $c by YongAn Huang, Zhouping Yin, Xiaodong Wan.
250 $a 1st ed. 2019.
264 1 $a Singapore : $b Springer Singapore : $b Imprint: Springer, $c 2019.
300 $a XVII, 287 p. $b online resource.
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
347 $a text file $b PDF $2 rda
505 0 $a Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.
520 $a This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
650 0 $a Electronics. $3 596389
650 0 $a Microelectronics. $3 554956
650 0 $a Optical materials. $3 672695
650 0 $a Electronic materials. $3 1253592
650 0 $a Manufactures. $3 680602
650 0 $a Mechanics. $3 527684
650 0 $a Mechanics, Applied. $3 596630
650 0 $a Computer simulation. $3 560190
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 670219
650 2 4 $a Optical and Electronic Materials. $3 593919
650 2 4 $a Manufacturing, Machines, Tools, Processes. $3 1226012
650 2 4 $a Theoretical and Applied Mechanics. $3 670861
650 2 4 $a Simulation and Modeling. $3 669249
700 1 $a Yin, Zhouping. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1226010
700 1 $a Wan, Xiaodong. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1226011
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer Nature eBook
776 0 8 $i Printed edition: $z 9789811336263
776 0 8 $i Printed edition: $z 9789811336287
856 4 0 $u https://doi.org/10.1007/978-981-13-3627-0
912 $a ZDB-2-ENG
912 $a ZDB-2-SXE
950 $a Engineering (SpringerNature-11647)
950 $a Engineering (R0) (SpringerNature-43712)