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Systems-Level Packaging for Millimet...
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Božanić, Mladen.
Systems-Level Packaging for Millimeter-Wave Transceivers
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Systems-Level Packaging for Millimeter-Wave Transceivers/ by Mladen Božanić, Saurabh Sinha.
作者:
Božanić, Mladen.
其他作者:
Sinha, Saurabh.
面頁冊數:
XV, 277 p.online resource. :
Contained By:
Springer Nature eBook
標題:
Wireless communication systems. -
電子資源:
https://doi.org/10.1007/978-3-030-14690-0
ISBN:
9783030146900
Systems-Level Packaging for Millimeter-Wave Transceivers
Božanić, Mladen.
Systems-Level Packaging for Millimeter-Wave Transceivers
[electronic resource] /by Mladen Božanić, Saurabh Sinha. - 1st ed. 2019. - XV, 277 p.online resource. - Smart Sensors, Measurement and Instrumentation,342194-8402 ;. - Smart Sensors, Measurement and Instrumentation,12.
Introduction and Research Impact -- Millimeter-Wave Research Challenges.-Behavior of Active and Passive Devices at Millimeter-Wave Frequencies -- Integrated Substrates: Millimeter-Wave Transistor Technologies -- Discrete Substrates: Package Foundation -- Traditional Approach: System-on-Chip -- Multi-Chip Modules and Multi-Chip Packaging -- State-of-the-Art Approach: System-on-Package -- Evaluation of Research Questions, Remaining Research Gaps and Future Directions.
This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
ISBN: 9783030146900
Standard No.: 10.1007/978-3-030-14690-0doiSubjects--Topical Terms:
562740
Wireless communication systems.
LC Class. No.: TK5103.2-.4885
Dewey Class. No.: 384.5
Systems-Level Packaging for Millimeter-Wave Transceivers
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