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Serviceology for Services = 7th International Conference, ICServ 2020, Osaka, Japan, March 13–15, 2020, Proceedings /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Serviceology for Services/ edited by Takeshi Takenaka, Spring Han, Chieko Minami.
其他題名:	7th International Conference, ICServ 2020, Osaka, Japan, March 13–15, 2020, Proceedings /
其他作者:	Minami, Chieko.
面頁冊數:	XI, 309 p. 119 illus., 80 illus. in color.online resource. :
Contained By:	Springer Nature eBook
標題:	Software Engineering. -
電子資源:	https://doi.org/10.1007/978-981-15-3118-7
ISBN:	9789811531187

Serviceology for Services = 7th International Conference, ICServ 2020, Osaka, Japan, March 13–15, 2020, Proceedings /
Serviceology for Services7th International Conference, ICServ 2020, Osaka, Japan, March 13–15, 2020, Proceedings /[electronic resource] :edited by Takeshi Takenaka, Spring Han, Chieko Minami. - 1st ed. 2020. - XI, 309 p. 119 illus., 80 illus. in color.online resource. - Communications in Computer and Information Science,11891865-0929 ;. - Communications in Computer and Information Science,498.

Hospitality Management -- Service Innovation and Employee engagement -- Service Marketing and Consumer Behavior -- Customer Experience and Service Design -- Service Engineering and Implementation.

This book constitutes the refereed proceedings of the 7th International Conference on Serviceology for Services, held in Osaka, Japan, in March 2020. The 16 full papers and 3 short papers presented in this volume were carefully reviewed and selected from 58 submissions. The papers are organized around the following topics: hospitality management; service innovation and employee engagement; service marketing and consumer behavior; customer experience and service design; service engineering and implementation.

ISBN: 9789811531187

Standard No.: 10.1007/978-981-15-3118-7doiSubjects--Topical Terms:

669632
Software Engineering.

LC Class. No.: QA75.5-76.95

Dewey Class. No.: 005.7

Serviceology for Services = 7th International Conference, ICServ 2020, Osaka, Japan, March 13–15, 2020, Proceedings /
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