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Blockchain and Applications = Intern...
~
Prieto, Javier.
Blockchain and Applications = International Congress /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Blockchain and Applications/ edited by Javier Prieto, Ashok Kumar Das, Stefano Ferretti, António Pinto, Juan Manuel Corchado.
Reminder of title:
International Congress /
other author:
Prieto, Javier.
Description:
XIII, 180 p. 97 illus., 40 illus. in color.online resource. :
Contained By:
Springer Nature eBook
Subject:
Engineering—Data processing. -
Online resource:
https://doi.org/10.1007/978-3-030-23813-1
ISBN:
9783030238131
Blockchain and Applications = International Congress /
Blockchain and Applications
International Congress /[electronic resource] :edited by Javier Prieto, Ashok Kumar Das, Stefano Ferretti, António Pinto, Juan Manuel Corchado. - 1st ed. 2020. - XIII, 180 p. 97 illus., 40 illus. in color.online resource. - Advances in Intelligent Systems and Computing,1010 2194-5357 ;. - Advances in Intelligent Systems and Computing,335.
IMBUA: Identity Management on Blockchain for Biometrics-based User Authentication -- Lightning Network: A Comparative Review of Transaction Fees and Data Analysis -- Do Smart Contract Languages Need to be Turing Complete -- Towards Integration of Blockchain and IoT: A Bibliometric Analysis of State-of-the-Art -- Smart Contracts are more than Objects: Pro-activeness on the Blockchain -- Blockchain Based Informed Consent With Reputation Support -- Privacy Centric Collaborative Machine Learning Model Training via Blockchain -- A balanced routing algorithm for blockchain offline channels using flocking .
This book gathers the refereed proceedings of the 1st International Congress on Blockchain and Applications 2019, BLOCKCHAIN’19, held in Ávila, Spain, in June 2019. Among the scientific community, blockchain and artificial intelligence are broadly considered to offer a promising combination that could transform the production and manufacturing industry, media, finance, insurance, e-government, etc. Nevertheless, there is no generally accepted approach, nor established best practices, for combining blockchain and artificial intelligence. The 21 papers presented here were carefully reviewed and selected from over 40 submissions. They highlight the latest advances in blockchain, artificial intelligence and their application domains, exploring innovative ideas, guidelines, theories, models, technologies, and tools, and identifying critical issues and challenges that researchers and practitioners will face in the near future. We wish to thank the sponsors: IEEE Systems Man and Cybernetics Society, Spain Section Chapter, and the IEEE Spain Section (Technical Co-Sponsor), IBM, Indra, Viewnext, Global Exchange, AEPIA, APPIA and AIR institute. .
ISBN: 9783030238131
Standard No.: 10.1007/978-3-030-23813-1doiSubjects--Topical Terms:
1297966
Engineering—Data processing.
LC Class. No.: TA345-345.5
Dewey Class. No.: 620.00285
Blockchain and Applications = International Congress /
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This book gathers the refereed proceedings of the 1st International Congress on Blockchain and Applications 2019, BLOCKCHAIN’19, held in Ávila, Spain, in June 2019. Among the scientific community, blockchain and artificial intelligence are broadly considered to offer a promising combination that could transform the production and manufacturing industry, media, finance, insurance, e-government, etc. Nevertheless, there is no generally accepted approach, nor established best practices, for combining blockchain and artificial intelligence. The 21 papers presented here were carefully reviewed and selected from over 40 submissions. They highlight the latest advances in blockchain, artificial intelligence and their application domains, exploring innovative ideas, guidelines, theories, models, technologies, and tools, and identifying critical issues and challenges that researchers and practitioners will face in the near future. We wish to thank the sponsors: IEEE Systems Man and Cybernetics Society, Spain Section Chapter, and the IEEE Spain Section (Technical Co-Sponsor), IBM, Indra, Viewnext, Global Exchange, AEPIA, APPIA and AIR institute. .
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