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Insert Devices and Integral Roughness in Heat Transfer Enhancement

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Insert Devices and Integral Roughness in Heat Transfer Enhancement/ by Sujoy Kumar Saha, Hrishiraj Ranjan, Madhu Sruthi Emani, Anand Kumar Bharti.
作者:	Saha, Sujoy Kumar.
其他作者:	Bharti, Anand Kumar.
面頁冊數:	IX, 177 p. 194 illus., 99 illus. in color.online resource. :
Contained By:	Springer Nature eBook
標題:	Characterization and Evaluation of Materials. -
電子資源:	https://doi.org/10.1007/978-3-030-20776-2
ISBN:	9783030207762

Insert Devices and Integral Roughness in Heat Transfer Enhancement
Saha, Sujoy Kumar.

Insert Devices and Integral Roughness in Heat Transfer Enhancement[electronic resource] /by Sujoy Kumar Saha, Hrishiraj Ranjan, Madhu Sruthi Emani, Anand Kumar Bharti. - 1st ed. 2020. - IX, 177 p. 194 illus., 99 illus. in color.online resource. - SpringerBriefs in Thermal Engineering and Applied Science,2193-2530. - SpringerBriefs in Thermal Engineering and Applied Science,.

Chapter 1. Introduction -- Chapter 2. Twisted-Tape Insert -- Chapter 3. Displaced Enhancement Devices and Wire Coil Inserts -- Chapter 4. Swirl Generators, Extended Surface Insert and Tangential Injection Devices -- Chapter 5. Numerical Simulation of Integral Roughness, Laminar Flow in Tubes with Roughness -- Chapter 6. 2D Roughness, 3D roughness and Roughness Applications -- Chapter 7. Compound Techniques -- Chapter 8. Conclusions.

This Brief describes heat transfer and pressure drop in heat transfer enhancement by insert devices and integral roughness. The authors deal with twisted-tape insert laminar and turbulent flow in tubes and annuli in smooth tubes and rough tubes, segmented twisted-tape inserts, displaced enhancement devices, wire coil inserts, extended surface inserts and tangential injection devices. The articles also address transverse and helical integral rib roughness, corrugated tube roughness, 3D and 2D roughness, rod bundles, outside roughness for cross flow, non-circular channels, Reynolds analogy and similarity law, numerical simulation and predictive models. The book is ideal for professionals and researchers working with thermal management in devices. .

ISBN: 9783030207762

Standard No.: 10.1007/978-3-030-20776-2doiSubjects--Topical Terms:

674449
Characterization and Evaluation of Materials.

LC Class. No.: TJ265

Dewey Class. No.: 621.4021

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