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Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution = Voltage Transfer Function and S-parameter Analyses /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution/ edited by Blaise Ravelo.
其他題名:	Voltage Transfer Function and S-parameter Analyses /
其他作者:	Ravelo, Blaise.
面頁冊數:	XIII, 233 p. 145 illus., 78 illus. in color.online resource. :
Contained By:	Springer Nature eBook
標題:	Communications Engineering, Networks. -
電子資源:	https://doi.org/10.1007/978-981-15-0552-2
ISBN:	9789811505522

Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution = Voltage Transfer Function and S-parameter Analyses /
Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal DistributionVoltage Transfer Function and S-parameter Analyses /[electronic resource] :edited by Blaise Ravelo. - 1st ed. 2020. - XIII, 233 p. 145 illus., 78 illus. in color.online resource.

General introduction -- Basic analysis of Single-Input Single-Output (SISO) PCB interconnect structure -- Discrete periodical model of microstrip line with cascaded elementary L-cells -- Modelling of the signal delay induced by PCB interconnect SISO structure -- Analytical modelling methodology of Single-Input Multiple Output (SIMO) symmetric tree interconnects by using lumped element L-cell -- Symmetric tree interconnects modelling with elementary distributed RC-line -- Z/Y/T/S-matrices modelling of symmetric SIMO structure based on elementary distributed RLC-cell -- Z/Y/T/S-matrices analysis of non-symmetric SIMO tree based on elementary distributed element -- Cartographical analyses of reflection and transmission coefficients of shunt coupled lines -- Analytical modelling of interbranch coupling effect on coupled microstrip tree PCB interconnects -- Temperature effect analysis on microstrip structure -- General conclusion.

This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering. .

ISBN: 9789811505522

Standard No.: 10.1007/978-981-15-0552-2doiSubjects--Topical Terms:

669809
Communications Engineering, Networks.

LC Class. No.: TK7876-7876.42

Dewey Class. No.: 621.3

Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution = Voltage Transfer Function and S-parameter Analyses /
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505 0 $a General introduction -- Basic analysis of Single-Input Single-Output (SISO) PCB interconnect structure -- Discrete periodical model of microstrip line with cascaded elementary L-cells -- Modelling of the signal delay induced by PCB interconnect SISO structure -- Analytical modelling methodology of Single-Input Multiple Output (SIMO) symmetric tree interconnects by using lumped element L-cell -- Symmetric tree interconnects modelling with elementary distributed RC-line -- Z/Y/T/S-matrices modelling of symmetric SIMO structure based on elementary distributed RLC-cell -- Z/Y/T/S-matrices analysis of non-symmetric SIMO tree based on elementary distributed element -- Cartographical analyses of reflection and transmission coefficients of shunt coupled lines -- Analytical modelling of interbranch coupling effect on coupled microstrip tree PCB interconnects -- Temperature effect analysis on microstrip structure -- General conclusion.
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