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Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering/ edited by Zhiguang Cheng, Norio Takahashi, Behzad Forghani.
other author:	Cheng, Zhiguang.
Description:	XXX, 685 p. 623 illus., 232 illus. in color.online resource. :
Contained By:	Springer Nature eBook
Subject:	Power electronics. -
Online resource:	https://doi.org/10.1007/978-981-15-0173-9
ISBN:	9789811501739

Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering
Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering[electronic resource] /edited by Zhiguang Cheng, Norio Takahashi, Behzad Forghani. - 1st ed. 2020. - XXX, 685 p. 623 illus., 232 illus. in color.online resource.

General Survey -- Low Frequency Electromagnetic Fields and the Finite Element Method -- Some Key Techniques in Electromagnetic and Thermal Field Modeling -- Solution of Coupled Electromagnetic-Thermal Fields -- Development of the API-based Script -- Harmonic-Balance Finite-Element Method and Its Application -- Magnetic Material Modeling -- Measurements of Multi-Directional Anisotropy Using Epstein Frame -- Electromagnetic Properties Modeling Based on Laminated Core Models -- Electromagnetic Properties Modeling Based on Ring Type Core Models -- Magnetic Properties Measurement under Extreme Excitation Conditions -- Problem 21 Benchmark Family and Stray-Field Loss Problems -- Additional Loss caused by the Magnetic Flux Normal to the Plane of Laminations -- Electromagnetic and Thermal Modeling based on Transformer Model -- Modeling DC Bias in Transformers.

Co-authored by an international research group with a long-standing cooperation, this book focuses on engineering-oriented electromagnetic and thermal field modeling and application. It presents important contributions, including advanced and efficient finite element analysis used in the solution of electromagnetic and thermal field problems for large and multi-scale engineering applications involving application script development; magnetic measurement of both magnetic materials and components under various, even extreme conditions, based on well-established (standard and non-standard) experimental systems; and multi-level validation based on both industrial test systems and extended TEAM P21 benchmarking platform. Although these are challenging topics, they are useful for readers from both academia and industry.

ISBN: 9789811501739

Standard No.: 10.1007/978-981-15-0173-9doiSubjects--Topical Terms:

561011
Power electronics.

LC Class. No.: TK7881.15

Dewey Class. No.: 621.317

Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering
LDR:03088nam a22003975i 4500 001 1027544
003 DE-He213
005 20200630214719.0
007 cr nn 008mamaa
008 210318s2020 si | s |||| 0|eng d
020 $a 9789811501739 $9 978-981-15-0173-9
024 7 $a 10.1007/978-981-15-0173-9 $2 doi
035 $a 978-981-15-0173-9
050 4 $a TK7881.15
072 7 $a THR $2 bicssc
072 7 $a TEC046000 $2 bisacsh
072 7 $a THR $2 thema
082 0 4 $a 621.317 $2 23
245 1 0 $a Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering $h [electronic resource] / $c edited by Zhiguang Cheng, Norio Takahashi, Behzad Forghani.
250 $a 1st ed. 2020.
264 1 $a Singapore : $b Springer Singapore : $b Imprint: Springer, $c 2020.
300 $a XXX, 685 p. 623 illus., 232 illus. in color. $b online resource.
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
347 $a text file $b PDF $2 rda
505 0 $a General Survey -- Low Frequency Electromagnetic Fields and the Finite Element Method -- Some Key Techniques in Electromagnetic and Thermal Field Modeling -- Solution of Coupled Electromagnetic-Thermal Fields -- Development of the API-based Script -- Harmonic-Balance Finite-Element Method and Its Application -- Magnetic Material Modeling -- Measurements of Multi-Directional Anisotropy Using Epstein Frame -- Electromagnetic Properties Modeling Based on Laminated Core Models -- Electromagnetic Properties Modeling Based on Ring Type Core Models -- Magnetic Properties Measurement under Extreme Excitation Conditions -- Problem 21 Benchmark Family and Stray-Field Loss Problems -- Additional Loss caused by the Magnetic Flux Normal to the Plane of Laminations -- Electromagnetic and Thermal Modeling based on Transformer Model -- Modeling DC Bias in Transformers.
520 $a Co-authored by an international research group with a long-standing cooperation, this book focuses on engineering-oriented electromagnetic and thermal field modeling and application. It presents important contributions, including advanced and efficient finite element analysis used in the solution of electromagnetic and thermal field problems for large and multi-scale engineering applications involving application script development; magnetic measurement of both magnetic materials and components under various, even extreme conditions, based on well-established (standard and non-standard) experimental systems; and multi-level validation based on both industrial test systems and extended TEAM P21 benchmarking platform. Although these are challenging topics, they are useful for readers from both academia and industry.
650 0 $a Power electronics. $3 561011
650 0 $a Microwaves. $3 636639
650 0 $a Optical engineering. $3 720802
650 0 $a Magnetism. $3 579937
650 0 $a Magnetic materials. $3 639418
650 0 $a Engineering mathematics. $3 562757
650 0 $a Computer simulation. $3 560190
650 1 4 $a Power Electronics, Electrical Machines and Networks. $3 768690
650 2 4 $a Microwaves, RF and Optical Engineering. $3 593918
650 2 4 $a Magnetism, Magnetic Materials. $3 671150
650 2 4 $a Engineering Mathematics. $3 1203947
650 2 4 $a Simulation and Modeling. $3 669249
700 1 $a Cheng, Zhiguang. $e editor. $4 edt $4 http://id.loc.gov/vocabulary/relators/edt $3 1323956
700 1 $a Takahashi, Norio. $e editor. $4 edt $4 http://id.loc.gov/vocabulary/relators/edt $3 1323957
700 1 $a Forghani, Behzad. $e editor. $4 edt $4 http://id.loc.gov/vocabulary/relators/edt $3 1323958
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer Nature eBook
776 0 8 $i Printed edition: $z 9789811501722
776 0 8 $i Printed edition: $z 9789811501746
776 0 8 $i Printed edition: $z 9789811501753
856 4 0 $u https://doi.org/10.1007/978-981-15-0173-9
912 $a ZDB-2-ENG
912 $a ZDB-2-SXE
950 $a Engineering (SpringerNature-11647)
950 $a Engineering (R0) (SpringerNature-43712)