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3D integration in VLSI circuits = implementation technologies and applications /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	3D integration in VLSI circuits/ edited by Katsuyuki Sakuma ; managing editor, Krzysztof Iniewski.
Reminder of title:	implementation technologies and applications /
other author:	Iniewski, Krzysztof.
Published:	Boca Raton, FL :CRC Press, : c2018.,
Description:	1 online resource (xvi, 217 p.)
Subject:	Integrated circuits - Very large scale integration. -
Online resource:	https://www.taylorfrancis.com/books/9781315200699
ISBN:	9781315200699

3D integration in VLSI circuits = implementation technologies and applications /
3D integration in VLSI circuitsimplementation technologies and applications /[electronic resource] :edited by Katsuyuki Sakuma ; managing editor, Krzysztof Iniewski. - 1st ed. - Boca Raton, FL :CRC Press,c2018. - 1 online resource (xvi, 217 p.) - Devices, circuits, and systems. - Devices, circuits, and systems..

Includes bibliographical references and index.

3D Integration: Technology and Design / P. Franzon -- 3D SiP for ASIC and 3D DRAM Integration / L. Li -- A New Class of High-capacity, Resource-rich FPGAs Enabled by 3D-IC Stacked Silicon Interconnect Technology (SSIT) / S. Ramalingam, Henley Liu, Myongseob Kim, Boon Ang, Woon-Seong Kwon, Tom Lee, Susan Wu, Jonathan Chang, Ephrem Wu, Xin Wu, and Liam Madden -- Challenges in 3D / M. Koyanagi, T. Fukushima, and T. Tanaka -- Wafer-Level Three-Dimensional Integration (3DI) using Bumpless Interconnects and Ultra-Thinning / T. Ohba -- 3DI stacking technologies for high volume manufacturing by use of wafer level oxide bonding integration / S. Skordas, K. Sakuma, K. Winstel, and C. Kothandaraman -- Toward 3D high density / S. Cheramy, A. Jouve, C. Fenouillet-Beranger, P. Vivet, and L. Di Cioccio -- Novel Platforms and Applications Using 3D and Heterogeneous Integration Technologies / K-N. Chen, Ting-Yang Yu, Yu-Chen Hu, Cheng-Hsien Lu.

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe--

ISBN: 9781315200699

Standard No.: 10.1201/9781315200699doiSubjects--Topical Terms:

563475
Integrated circuits
--Very large scale integration.

LC Class. No.: TK7874.893 / .A16 2018

Dewey Class. No.: 621.395

3D integration in VLSI circuits = implementation technologies and applications /
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245 0 0 $a 3D integration in VLSI circuits $h [electronic resource] : $b implementation technologies and applications / $c edited by Katsuyuki Sakuma ; managing editor, Krzysztof Iniewski.
250 $a 1st ed.
260 $a Boca Raton, FL : $b CRC Press, $c c2018.
300 $a 1 online resource (xvi, 217 p.)
490 1 $a Devices, circuits, and systems
504 $a Includes bibliographical references and index.
505 0 $a 3D Integration: Technology and Design / P. Franzon -- 3D SiP for ASIC and 3D DRAM Integration / L. Li -- A New Class of High-capacity, Resource-rich FPGAs Enabled by 3D-IC Stacked Silicon Interconnect Technology (SSIT) / S. Ramalingam, Henley Liu, Myongseob Kim, Boon Ang, Woon-Seong Kwon, Tom Lee, Susan Wu, Jonathan Chang, Ephrem Wu, Xin Wu, and Liam Madden -- Challenges in 3D / M. Koyanagi, T. Fukushima, and T. Tanaka -- Wafer-Level Three-Dimensional Integration (3DI) using Bumpless Interconnects and Ultra-Thinning / T. Ohba -- 3DI stacking technologies for high volume manufacturing by use of wafer level oxide bonding integration / S. Skordas, K. Sakuma, K. Winstel, and C. Kothandaraman -- Toward 3D high density / S. Cheramy, A. Jouve, C. Fenouillet-Beranger, P. Vivet, and L. Di Cioccio -- Novel Platforms and Applications Using 3D and Heterogeneous Integration Technologies / K-N. Chen, Ting-Yang Yu, Yu-Chen Hu, Cheng-Hsien Lu.
520 $a Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe-- $c Provided by publisher.
588 $a Description based on print version record.
650 0 $a Integrated circuits $x Very large scale integration. $3 563475
650 0 $a Three-dimensional integrated circuits. $3 880880
700 1 $a Iniewski, Krzysztof. $3 632779
700 1 $a Sakuma, Katsuyuki. $3 1224083
830 0 $a Devices, circuits, and systems. $3 797950
856 4 0 $u https://www.taylorfrancis.com/books/9781315200699