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Embedded mechatronic systems.. 2,. Analyses of failures, modeling, simulation and optimization

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Embedded mechatronic systems./ edited by Abdelkhalak El Hami, Philippe Pougnet.
其他題名:	Analyses of failures, modeling, simulation and optimization
其他作者:	Pougnet, Philippe,
出版者:	London :ISTE, Ltd. ; : 2020.,
面頁冊數:	1 online resource (300 p.)
附註:	9.1. Introduction
標題:	Mechatronics. -
電子資源:	https://www.sciencedirect.com/science/book/9781785481901
ISBN:	9780081019566 (electronic bk.)

Embedded mechatronic systems.. 2,. Analyses of failures, modeling, simulation and optimization
Embedded mechatronic systems.2,Analyses of failures, modeling, simulation and optimization[electronic resource] /Analyses of failures, modeling, simulation and optimizationedited by Abdelkhalak El Hami, Philippe Pougnet. - Second edition. - London :ISTE, Ltd. ;2020. - 1 online resource (300 p.)

9.1. Introduction

Front Cover -- Embedded Mechatronic Systems 2: Analyses of Failures, Modeling, Simulation and Optimization -- Copyright page -- Contents -- Preface -- 1. Highly Accelerated Testing -- 1.1. Introduction -- 1.2. Load characteristics of the Super HAT equipment -- 1.3. Description of the Super HAT system -- 1.4. Application -- 1.5. Conclusion -- 1.6. References -- 2. Aging Power Transistors in Operational Conditions -- 2.1. Introduction -- 2.2. Aging microwave power electronic components under operational conditions -- 2.3. Application to the study of microwave power transistors

ISBN: 9780081019566 (electronic bk.)Subjects--Topical Terms:

559133
Mechatronics.
Index Terms--Genre/Form:

554714
Electronic books.

LC Class. No.: TJ163.12 / .E63 2020

Dewey Class. No.: 006.2/2

Embedded mechatronic systems.. 2,. Analyses of failures, modeling, simulation and optimization
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260 $a London : $a Kidlington : $b ISTE, Ltd. ; $c 2020. $b Elsevier,
300 $a 1 online resource (300 p.)
500 $a 9.1. Introduction
505 0 $a Front Cover -- Embedded Mechatronic Systems 2: Analyses of Failures, Modeling, Simulation and Optimization -- Copyright page -- Contents -- Preface -- 1. Highly Accelerated Testing -- 1.1. Introduction -- 1.2. Load characteristics of the Super HAT equipment -- 1.3. Description of the Super HAT system -- 1.4. Application -- 1.5. Conclusion -- 1.6. References -- 2. Aging Power Transistors in Operational Conditions -- 2.1. Introduction -- 2.2. Aging microwave power electronic components under operational conditions -- 2.3. Application to the study of microwave power transistors
505 8 $a 2.4. Conclusion -- 2.5. References -- 3. Physical Defects Analysis of Mechatronic Systems -- 3.1. Introduction -- 3.2. Equipment and methodology for analyzing failure inmechatronic systems -- 3.3. Analysis of physical defects -- 3.4. Conclusion -- 3.5. References -- 4. Impact of Voids in Interconnection Materials -- 4.1. Introduction -- 4.2. Thermal transfer and thermo-elasticity -- 4.3. Description of the numerical method -- 4.4. Simulation of thermal and thermomechanical effects in the interconnection material of an electronic module -- 4.5. Conclusion -- 4.6. References
505 8 $a 5. Electro-Thermo-Mechanical Modeling -- 5.1. Introduction -- 5.2. Theory of electro-thermo-mechanical coupling -- 5.3. Simulation of electro-thermo-mechanical behavior using the finite element method -- 5.4. Example of an electro-thermo-mechanical simulation of an HBT transistor -- 5.5. Modal analysis of mechanical components -- 5.6. Stochastic modal analysis of structures -- 5.7. Numerical identification of the elastic parameters of electronic components -- 5.8. Example of modeling and simulation of the vibratory behavior of mechatronic components -- 5.9. Conclusion
505 8 $a 5.10. List of abbreviations and symbols -- 5.11. References -- 6. Meta-Model Development -- 6.1. Introduction -- 6.2. Definition of a meta-model -- 6.3. Selection of factors: screening -- 6.4. Creation of designs of experiments -- 6.5. Modeling of the response surface: PLS regression and Kriging -- 6.6. Sensitivity analysis of the model: variance decomposition, Sobol criterion -- 6.7. Robust design -- 6.8. Conclusion -- 6.9. References -- 7. Probabilistic Study and Optimization of a Solder Interconnect -- 7.1. Introduction -- 7.2. Electronic equipment
505 8 $a 7.3. Thermal modeling of the electronic board -- 7.4. Probabilistic study of the effect of thermomechanical stresses on a solder joint -- 7.5. Optimization of the solder joint -- 7.6. Conclusion -- 7.7. References -- 8. High-Efficiency Architecture for Power Amplifiers -- 8.1. Introduction -- 8.2. Main reliability parameters -- 8.3. Methodology -- 8.4. Aging tests -- 8.5. Other results -- 8.6. Origin of degradations: discussion -- 8.7. Physical analysis -- 8.8. Amplifier design rules -- 8.9. Conclusion -- 8.10. References -- 9. Reliability Analysis based on Metamodels of Chip-Scale Packages (CSP)
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