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Numerical Simulation of Pressure Drop Across Micro-Pin-Fin Arrays.

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Numerical Simulation of Pressure Drop Across Micro-Pin-Fin Arrays./
Author:	Macalalag, Adam James.
Published:	Ann Arbor : ProQuest Dissertations & Theses, : 2021,
Description:	65 p.
Notes:	Source: Masters Abstracts International, Volume: 83-02.
Contained By:	Masters Abstracts International83-02.
Subject:	Mechanical engineering. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=28495228
ISBN:	9798535532943

Numerical Simulation of Pressure Drop Across Micro-Pin-Fin Arrays.
Macalalag, Adam James.

Numerical Simulation of Pressure Drop Across Micro-Pin-Fin Arrays. - Ann Arbor : ProQuest Dissertations & Theses, 2021 - 65 p.

Source: Masters Abstracts International, Volume: 83-02.

Thesis (M.S.)--University of Hawai'i at Manoa, 2021.

This item must not be sold to any third party vendors.

Liquid-cooled micro-pin-fin heat sink thermal design and performance assessment requires an accurate understanding and prediction of pressure drop and heat transfer associated with liquid single-phase flow in micro-pin-fin arrays. This study investigated water flow pressure drop across micro-pin-fin arrays with different geometries using numerical simulations implemented with COMSOL Multiphysics software. COMSOL simulations were modeled after an existing experimental set up (180 μm in diameter, 683 μm in height, and 399 μm in both longitudinal and transverse pitches) and previously studied numerical analyses (various height to diameter ratios) were performed. COMSOL results were compared to experimental and numerical results. Lower mean absolute error (MAE) values showed good agreement and validated the COMSOL simulations. Once validated, 2D and 3D numerical simulation of various micro-pin-fin array geometries were conducted over seven Re numbers (20, 50, 100, 215, 410, 605, 800). Various changes to transverse pin separation (Wsp), longitudinal pin separation (Lsp), and diameter were modeled and simulated. The results showed that an increase Wsp decreased friction factor and vice versa. Changes to Lsp had little effect on friction factor. Lastly, an increase in pin diameter increased friction factor. These results provide a better understanding of flow resistance and its relationship to the geometrical parameters.

ISBN: 9798535532943Subjects--Topical Terms:

557493
Mechanical engineering.
Subjects--Index Terms:

Micro-pin-fin

Numerical Simulation of Pressure Drop Across Micro-Pin-Fin Arrays.
LDR:02478nam a2200337 4500 001 1067187
005 20220823142311.5
008 221020s2021 ||||||||||||||||| ||eng d
020 $a 9798535532943
035 $a (MiAaPQ)AAI28495228
035 $a AAI28495228
040 $a MiAaPQ $c MiAaPQ
100 1 $a Macalalag, Adam James. $3 1372581
245 1 0 $a Numerical Simulation of Pressure Drop Across Micro-Pin-Fin Arrays.
260 1 $a Ann Arbor : $b ProQuest Dissertations & Theses, $c 2021
300 $a 65 p.
500 $a Source: Masters Abstracts International, Volume: 83-02.
500 $a Advisor: Qu, Weilin.
502 $a Thesis (M.S.)--University of Hawai'i at Manoa, 2021.
506 $a This item must not be sold to any third party vendors.
520 $a Liquid-cooled micro-pin-fin heat sink thermal design and performance assessment requires an accurate understanding and prediction of pressure drop and heat transfer associated with liquid single-phase flow in micro-pin-fin arrays. This study investigated water flow pressure drop across micro-pin-fin arrays with different geometries using numerical simulations implemented with COMSOL Multiphysics software. COMSOL simulations were modeled after an existing experimental set up (180 μm in diameter, 683 μm in height, and 399 μm in both longitudinal and transverse pitches) and previously studied numerical analyses (various height to diameter ratios) were performed. COMSOL results were compared to experimental and numerical results. Lower mean absolute error (MAE) values showed good agreement and validated the COMSOL simulations. Once validated, 2D and 3D numerical simulation of various micro-pin-fin array geometries were conducted over seven Re numbers (20, 50, 100, 215, 410, 605, 800). Various changes to transverse pin separation (Wsp), longitudinal pin separation (Lsp), and diameter were modeled and simulated. The results showed that an increase Wsp decreased friction factor and vice versa. Changes to Lsp had little effect on friction factor. Lastly, an increase in pin diameter increased friction factor. These results provide a better understanding of flow resistance and its relationship to the geometrical parameters.
590 $a School code: 0085.
650 4 $a Mechanical engineering. $3 557493
650 4 $a Friction. $3 596760
650 4 $a Agreements. $3 1372582
650 4 $a Heat transfer. $3 1085480
650 4 $a Simulation. $3 998515
650 4 $a Software. $2 gtt $3 574116
650 4 $a Viscosity. $3 641960
650 4 $a Investigations. $3 1372519
650 4 $a Flow velocity. $3 1372583
650 4 $a Symmetry. $3 569115
650 4 $a Numerical analysis. $3 527939
650 4 $a Ratios. $3 1372584
650 4 $a Arrays. $3 1372585
650 4 $a Boundary conditions. $3 1372586
650 4 $a Geometry. $3 579899
653 $a Micro-pin-fin
653 $a Heat sink
653 $a Thermal design
653 $a Heat transfer
690 $a 0548
710 2 $a University of Hawai'i at Manoa. $b Mechanical Engineering. $3 1186199
773 0 $t Masters Abstracts International $g 83-02.
790 $a 0085
791 $a M.S.
792 $a 2021
793 $a English
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=28495228