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Electronic packaging science and technology /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Electronic packaging science and technology // King-Ning Tu, Chih Chen, Hung-Ming Chen.
作者:	Tu, K. N.
其他作者:	Chen, Chih,
出版者:	Hoboken, NJ :Wiley, : c2022.,
面頁冊數:	xii, 315 p. :ill. ; : 24 cm.;
標題:	Electronic packaging. -
ISBN:	9781119418313 (hbk.) :

Electronic packaging science and technology /
Tu, K. N.1937-

Electronic packaging science and technology /King-Ning Tu, Chih Chen, Hung-Ming Chen. - 1st ed. - Hoboken, NJ :Wiley,c2022. - xii, 315 p. :ill. ;24 cm.

Includes bibliographical references and index.

"This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology"--

ISBN: 9781119418313 (hbk.) :NT1760Subjects--Topical Terms:

556061
Electronic packaging.

LC Class. No.: TK7870.15

Dewey Class. No.: 621.381/046

Electronic packaging science and technology /
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020 $a 9781119418313 (hbk.) : $c NT1760
020 $a 1119418321 (adobe pdf)
020 $a 9781119418320 (adobe pdf)
020 $z 111941833X (epub)
020 $z 1119418348 (ebk. : oBook)
020 $z 9781119418337 (epub)
020 $z 9781119418344 (ebk. oBook)
035 $a (OCoLC)1268544247
040 $a DLC $b eng $e aacr2 $c DLC $d OCLCO $d DG1 $d OCLCO
042 $a pcc
050 0 0 $a TK7870.15
082 0 0 $a 621.381/046 $2 23
100 1 $a Tu, K. N. $q (King-ning), $d 1937- $3 926065
245 1 0 $a Electronic packaging science and technology / $c King-Ning Tu, Chih Chen, Hung-Ming Chen.
250 $a 1st ed.
260 # $a Hoboken, NJ : $b Wiley, $c c2022.
300 $a xii, 315 p. : $b ill. ; $c 24 cm.
504 $a Includes bibliographical references and index.
520 # $a "This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology"-- $c Provided by publisher.
650 # 0 $a Electronic packaging. $3 556061
700 1 # $a Chen, Chih, $d 1970- $3 1384099
700 1 # $a Chen, Hung-Ming. $3 1384100