國立虎尾科技大學 |

Language: English

Back

Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : = high performance compute and system-in-package /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces :/ edited by Beth Keser, Steffen Kröhnert.
Reminder of title:	high performance compute and system-in-package /
remainder title:	High performance compute and system-in-package
other author:	Kroehnert, Steffen,
Published:	Hoboken, NJ :Wiley-IEEE Press, : c2022.,
Description:	xv, 296 p. :ill. ; : 24 cm.;
Subject:	Chip scale packaging. -
ISBN:	9781119793779 (hbk.) :

Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : = high performance compute and system-in-package /
Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces :high performance compute and system-in-package /High performance compute and system-in-packageedited by Beth Keser, Steffen Kröhnert. - Hoboken, NJ :Wiley-IEEE Press,c2022. - xv, 296 p. :ill. ;24 cm.

Includes bibliographical references and index.

ISBN: 9781119793779 (hbk.) :NT1750 Subjects--Topical Terms:

1062722
Chip scale packaging.

LC Class. No.: TK7870.17 / .E434 2022

Dewey Class. No.: 621.395

Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : = high performance compute and system-in-package /
LDR:00751cam a2200181 a 4500 001 1080715
003 OCoLC
005 20221208213122.0
008 221219s2022 njua f b 001 0 eng d
020 $a 9781119793779 (hbk.) : $c NT1750
035 $a (OCoLC)1310421673
040 $a UKAHL $b eng $e aacr2 $c UKAHL $d OCLCO $d SFB $d OCLCF
050 # 4 $a TK7870.17 $b .E434 2022
082 0 4 $a 621.395 $2 23
245 0 0 $a Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : $b high performance compute and system-in-package / $c edited by Beth Keser, Steffen Kröhnert.
246 3 0 $a High performance compute and system-in-package
260 # $a Hoboken, NJ : $b Wiley-IEEE Press, $c c2022.
300 $a xv, 296 p. : $b ill. ; $c 24 cm.
504 $a Includes bibliographical references and index.
650 # 0 $a Chip scale packaging. $3 1062722
650 # 0 $a Integrated circuits $x Wafer-scale integration. $3 782939
650 # 0 $a Microelectronics. $3 554956
700 1 # $a Kroehnert, Steffen, $d 1970- $3 1386244
700 1 # $a Keser, Beth, $d 1971- $e editor. $3 1222001