| Record Type: |
Language materials, printed
: Monograph/item
|
| Title/Author: |
TSV 3D RF integration :/ Shenglin Ma, Yufeng Jin. |
| Reminder of title: |
high resistivity Si interposer technology / |
| Author: |
Ma, Shenglin, |
| other author: |
Jin, Yufeng, |
| Published: |
Amsterdam, Netherlands :Elsevier, : c2022., |
| Description: |
xvii, 273 p. :ill. (some col.) ; : 24 cm.; |
| Subject: |
Radio frequency integrated circuits. - |
| ISBN: |
9780323996020 (pbk.) : |