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TSV 3D RF integration : = high resistivity Si interposer technology /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	TSV 3D RF integration :/ Shenglin Ma, Yufeng Jin.
其他題名:	high resistivity Si interposer technology /
作者:	Ma, Shenglin,
其他作者:	Jin, Yufeng,
出版者:	Amsterdam, Netherlands :Elsevier, : c2022.,
面頁冊數:	xvii, 273 p. :ill. (some col.) ; : 24 cm.;
標題:	Three-dimensional integrated circuits. -
ISBN:	9780323996020 (pbk.) :

TSV 3D RF integration : = high resistivity Si interposer technology /
Ma, Shenglin,

TSV 3D RF integration :high resistivity Si interposer technology /Shenglin Ma, Yufeng Jin. - Amsterdam, Netherlands :Elsevier,c2022. - xvii, 273 p. :ill. (some col.) ;24 cm.

Includes bibliographical references and index.

ISBN: 9780323996020 (pbk.) :NT7734Subjects--Topical Terms:

880880
Three-dimensional integrated circuits.

LC Class. No.: TK7874.893

Dewey Class. No.: 621.3815

TSV 3D RF integration : = high resistivity Si interposer technology /
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020 $z 9780323996037 (ebook)
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035 $a on1320852579
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041 0 # $a eng
050 # 4 $a TK7874.893
082 0 4 $a 621.3815 $2 23
100 1 $a Ma, Shenglin, $e author. $3 1386276
245 1 0 $a TSV 3D RF integration : $b high resistivity Si interposer technology / $c Shenglin Ma, Yufeng Jin.
260 # $a Amsterdam, Netherlands : $b Elsevier, $c c2022.
300 $a xvii, 273 p. : $b ill. (some col.) ; $c 24 cm.
504 $a Includes bibliographical references and index.
650 # 0 $a Three-dimensional integrated circuits. $3 880880
650 # 0 $a Silicon $x Electric properties. $3 641595
650 # 0 $a Radio frequency integrated circuits. $3 636641
700 1 # $a Jin, Yufeng, $e author. $3 1386277

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621.3815 M1113 2022

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1 records • Pages 1 •
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