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Three-Dimensional Integration and Modeling = A Revolution in RF and Wireless Packaging /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Three-Dimensional Integration and Modeling/ by Jong-Hoon Lee, Manos M. Tentzeris.
其他題名:	A Revolution in RF and Wireless Packaging /
作者:	Lee, Jong-Hoon.
其他作者:	Tentzeris, Manos M.
面頁冊數:	X, 108 p.online resource. :
Contained By:	Springer Nature eBook
標題:	Microwaves, RF Engineering and Optical Communications. -
電子資源:	https://doi.org/10.1007/978-3-031-01703-2
ISBN:	9783031017032

Three-Dimensional Integration and Modeling = A Revolution in RF and Wireless Packaging /
Lee, Jong-Hoon.

Three-Dimensional Integration and ModelingA Revolution in RF and Wireless Packaging /[electronic resource] :by Jong-Hoon Lee, Manos M. Tentzeris. - 1st ed. 2008. - X, 108 p.online resource. - Synthesis Lectures on Computational Electromagnetics,1932-1716. - Synthesis Lectures on Computational Electromagnetics,.

Introduction -- Background on Technologies for Millimeter-Wave Passive Front-Ends -- Three-Dimensional Packaging in Multilayer Organic Substrates -- Microstrip-Type Integrated Passives -- Cavity-Type Integrated Passives -- Three-Dimensional Antenna Architectures -- Fully Integrated Three-Dimensional Passive Front-Ends -- References.

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References.

ISBN: 9783031017032

Standard No.: 10.1007/978-3-031-01703-2doiSubjects--Topical Terms:

1365893
Microwaves, RF Engineering and Optical Communications.

LC Class. No.: T1-995

Dewey Class. No.: 620

Three-Dimensional Integration and Modeling = A Revolution in RF and Wireless Packaging /
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