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Optical Interconnects
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Optical Interconnects/ by Ray T. Chen, Chulchae Choi.
作者:
Chen, Ray T.
其他作者:
Choi, Chulchae.
面頁冊數:
XI, 91 p.online resource. :
Contained By:
Springer Nature eBook
標題:
Materials Science. -
電子資源:
https://doi.org/10.1007/978-3-031-02553-2
ISBN:
9783031025532
Optical Interconnects
Chen, Ray T.
Optical Interconnects
[electronic resource] /by Ray T. Chen, Chulchae Choi. - 1st ed. 2008. - XI, 91 p.online resource. - Synthesis Lectures on Solid State Materials and Devices,1932-1724. - Synthesis Lectures on Solid State Materials and Devices,.
Introduction -- Thinned Vertical Cavity Surface Emitting Laser Fabrication -- VCSEL Characterization -- Thermal Management of Embedded VCSEL -- Optical Interconnection Layer -- System Integration -- Summary -- Effects of Thermal-Via Structures on Thin Film VCSELs for a Fully Embedded Board-Level Optical Interconnection System.
This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.
ISBN: 9783031025532
Standard No.: 10.1007/978-3-031-02553-2doiSubjects--Topical Terms:
671087
Materials Science.
LC Class. No.: TK1-9971
Dewey Class. No.: 621.3
Optical Interconnects
LDR
:02627nam a22003735i 4500
001
1097468
003
DE-He213
005
20220601141319.0
007
cr nn 008mamaa
008
230315s2008 sz | s |||| 0|eng d
020
$a
9783031025532
$9
978-3-031-02553-2
024
7
$a
10.1007/978-3-031-02553-2
$2
doi
035
$a
978-3-031-02553-2
050
4
$a
TK1-9971
072
7
$a
THR
$2
bicssc
072
7
$a
TEC007000
$2
bisacsh
072
7
$a
THR
$2
thema
082
0 4
$a
621.3
$2
23
100
1
$a
Chen, Ray T.
$4
aut
$4
http://id.loc.gov/vocabulary/relators/aut
$3
598314
245
1 0
$a
Optical Interconnects
$h
[electronic resource] /
$c
by Ray T. Chen, Chulchae Choi.
250
$a
1st ed. 2008.
264
1
$a
Cham :
$b
Springer International Publishing :
$b
Imprint: Springer,
$c
2008.
300
$a
XI, 91 p.
$b
online resource.
336
$a
text
$b
txt
$2
rdacontent
337
$a
computer
$b
c
$2
rdamedia
338
$a
online resource
$b
cr
$2
rdacarrier
347
$a
text file
$b
PDF
$2
rda
490
1
$a
Synthesis Lectures on Solid State Materials and Devices,
$x
1932-1724
505
0
$a
Introduction -- Thinned Vertical Cavity Surface Emitting Laser Fabrication -- VCSEL Characterization -- Thermal Management of Embedded VCSEL -- Optical Interconnection Layer -- System Integration -- Summary -- Effects of Thermal-Via Structures on Thin Film VCSELs for a Fully Embedded Board-Level Optical Interconnection System.
520
$a
This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.
650
2 4
$a
Materials Science.
$3
671087
650
1 4
$a
Electrical and Electronic Engineering.
$3
1388937
650
0
$a
Materials science.
$3
557839
650
0
$a
Electrical engineering.
$3
596380
700
1
$a
Choi, Chulchae.
$4
aut
$4
http://id.loc.gov/vocabulary/relators/aut
$3
598319
710
2
$a
SpringerLink (Online service)
$3
593884
773
0
$t
Springer Nature eBook
776
0 8
$i
Printed edition:
$z
9783031014253
776
0 8
$i
Printed edition:
$z
9783031036811
830
0
$a
Synthesis Lectures on Solid State Materials and Devices,
$x
1932-1724
$3
1407316
856
4 0
$u
https://doi.org/10.1007/978-3-031-02553-2
912
$a
ZDB-2-SXSC
950
$a
Synthesis Collection of Technology (R0) (SpringerNature-85007)
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