國立虎尾科技大學 |

3D Laser Written Mirror-Waveguide Circuits for Silicon Photonic Interconnects.

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	3D Laser Written Mirror-Waveguide Circuits for Silicon Photonic Interconnects./
作者:	Rahimnouri, Amirhossein.
出版者:	Ann Arbor : ProQuest Dissertations & Theses, : 2021,
面頁冊數:	128 p.
附註:	Source: Masters Abstracts International, Volume: 83-06.
Contained By:	Masters Abstracts International83-06.
標題:	Optics. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=28771507
ISBN:	9798496547581

3D Laser Written Mirror-Waveguide Circuits for Silicon Photonic Interconnects.
Rahimnouri, Amirhossein.

3D Laser Written Mirror-Waveguide Circuits for Silicon Photonic Interconnects. - Ann Arbor : ProQuest Dissertations & Theses, 2021 - 128 p.

Source: Masters Abstracts International, Volume: 83-06.

Thesis (M.A.S.)--University of Toronto (Canada), 2021.

This item is not available from ProQuest Dissertations & Theses.

An increase in data usage following demands for faster networks over past decades has prompted data centers to scale up the density of channels and boost the network bandwidth. In this way, a new architecture for assembly and packaging of electro-optical (EO) components is now required to facilitate chip-to-chip and chip-to-network interconnections. This thesis employs femtosecond laser writing combined with 3D structural micro-machining for fabricating glass interposers and a new optical printed circuit board (OPCB) platform. The presented glass interposer provided vertical coupling from a plane of multi-core fiber (MCF) arrays to a two-dimensional (2D) grid of silicon photonics (SiP) grating couplers. The OPCB platform demonstrated a wider scope for all-glass optical routing by providing a high-density optical circuit for MCF-to-MCF linking. The interposer and OPCB optical systems provided tight-turning waveguide bends for 3D interconnectivity by developing total internal reflection (TIR) mirrors and 2D hollow-filament gratings photonic crystals (PhCs).

ISBN: 9798496547581Subjects--Topical Terms:

595336
Optics.
Subjects--Index Terms:

Mirror-waveguide circuits

3D Laser Written Mirror-Waveguide Circuits for Silicon Photonic Interconnects.
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245 1 0 $a 3D Laser Written Mirror-Waveguide Circuits for Silicon Photonic Interconnects.
260 1 $a Ann Arbor : $b ProQuest Dissertations & Theses, $c 2021
300 $a 128 p.
500 $a Source: Masters Abstracts International, Volume: 83-06.
500 $a Advisor: Herman, Peter Robert.
502 $a Thesis (M.A.S.)--University of Toronto (Canada), 2021.
506 $a This item is not available from ProQuest Dissertations & Theses.
506 $a This item must not be sold to any third party vendors.
520 $a An increase in data usage following demands for faster networks over past decades has prompted data centers to scale up the density of channels and boost the network bandwidth. In this way, a new architecture for assembly and packaging of electro-optical (EO) components is now required to facilitate chip-to-chip and chip-to-network interconnections. This thesis employs femtosecond laser writing combined with 3D structural micro-machining for fabricating glass interposers and a new optical printed circuit board (OPCB) platform. The presented glass interposer provided vertical coupling from a plane of multi-core fiber (MCF) arrays to a two-dimensional (2D) grid of silicon photonics (SiP) grating couplers. The OPCB platform demonstrated a wider scope for all-glass optical routing by providing a high-density optical circuit for MCF-to-MCF linking. The interposer and OPCB optical systems provided tight-turning waveguide bends for 3D interconnectivity by developing total internal reflection (TIR) mirrors and 2D hollow-filament gratings photonic crystals (PhCs).
590 $a School code: 0779.
650 4 $a Optics. $3 595336
650 4 $a Electrical engineering. $3 596380
653 $a Mirror-waveguide circuits
653 $a Silicon photonic interconnects
653 $a Optical printed circuit board
690 $a 0544
690 $a 0752
710 2 $a University of Toronto (Canada). $b Electrical and Computer Engineering. $3 1148628
773 0 $t Masters Abstracts International $g 83-06.
790 $a 0779
791 $a M.A.S.
792 $a 2021
793 $a English
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