國立虎尾科技大學 |

Theory and practice of thermal transient testing of electronic components

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Theory and practice of thermal transient testing of electronic components/ edited by Marta Rencz, Gábor Farkas, András Poppe.
其他作者:	Poppe, Andras.
出版者:	Cham :Springer International Publishing : : 2022.,
面頁冊數:	ix, 385 p. :ill., digital ; : 24 cm.;
Contained By:	Springer Nature eBook
標題:	Materials Engineering. -
電子資源:	https://doi.org/10.1007/978-3-030-86174-2
ISBN:	9783030861742

Theory and practice of thermal transient testing of electronic components
Theory and practice of thermal transient testing of electronic components[electronic resource] /edited by Marta Rencz, Gábor Farkas, András Poppe. - Cham :Springer International Publishing :2022. - ix, 385 p. :ill., digital ;24 cm.

Introduction: the Importance and Motivation -- Theoretical Background: History, the Network Identification by Deconvolution (NID) Method, Structure Functions, the Thermal Signature -- The Use of Thermal Transient Testing -- General Practical Questions and the Flow of Thermal Transient Measurements -- On the Accuracy and Repeatability of Thermal Measurements.

This book discusses the major aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book begins by presenting the theoretical background of creating structure functions from the measured results with mathematical details. It then moves on to show how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and the calibration of simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The special problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide band gap materials, and LEDs are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers. The first book dedicated solely to thermal transient testing; Enables readers to accomplish thermal transient testing on any type of electronics; Provides valuable use cases and highlights the specialties of characterizing different devices.

ISBN: 9783030861742

Standard No.: 10.1007/978-3-030-86174-2doiSubjects--Topical Terms:

1062318
Materials Engineering.

LC Class. No.: TK7870 / .T44 2022

Dewey Class. No.: 621.381

Theory and practice of thermal transient testing of electronic components
LDR:02818nam a2200325 a 4500 001 1105512
003 DE-He213
005 20230124120045.0
006 m d
007 cr nn 008maaau
008 231013s2022 sz s 0 eng d
020 $a 9783030861742 $q (electronic bk.)
020 $a 9783030861735 $q (paper)
024 7 $a 10.1007/978-3-030-86174-2 $2 doi
035 $a 978-3-030-86174-2
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7870 $b .T44 2022
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TJF $2 thema
082 0 4 $a 621.381 $2 23
090 $a TK7870 $b .T396 2022
245 0 0 $a Theory and practice of thermal transient testing of electronic components $h [electronic resource] / $c edited by Marta Rencz, Gábor Farkas, András Poppe.
260 $a Cham : $c 2022. $b Springer International Publishing : $b Imprint: Springer,
300 $a ix, 385 p. : $b ill., digital ; $c 24 cm.
505 0 $a Introduction: the Importance and Motivation -- Theoretical Background: History, the Network Identification by Deconvolution (NID) Method, Structure Functions, the Thermal Signature -- The Use of Thermal Transient Testing -- General Practical Questions and the Flow of Thermal Transient Measurements -- On the Accuracy and Repeatability of Thermal Measurements.
520 $a This book discusses the major aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book begins by presenting the theoretical background of creating structure functions from the measured results with mathematical details. It then moves on to show how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and the calibration of simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The special problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide band gap materials, and LEDs are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers. The first book dedicated solely to thermal transient testing; Enables readers to accomplish thermal transient testing on any type of electronics; Provides valuable use cases and highlights the specialties of characterizing different devices.
650 2 4 $a Materials Engineering. $3 1062318
650 2 4 $a Electronic Circuits and Systems. $3 1366689
650 2 4 $a Electrical Power Engineering. $3 1365891
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 670219
650 0 $a Electronic apparatus and appliances $x Testing. $3 636329
700 1 $a Poppe, Andras. $3 1020126
700 1 $a Farkas, Gabor. $3 1414563
700 1 $a Rencz, M. $3 1414562
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer Nature eBook
856 4 0 $u https://doi.org/10.1007/978-3-030-86174-2
950 $a Physics and Astronomy (SpringerNature-11651)