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Wire bonding in microelectronics
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Wire bonding in microelectronics/ George G. Harmon.
作者:
Harman, George G.
其他作者:
Harman, George G.
出版者:
New York :McGraw-Hill, : c2010.,
面頁冊數:
xx, 426 p. :ill. :
標題:
Semiconductors - Failures. -
電子資源:
Click for full text (McGrawHill)
ISBN:
9780071476232
Wire bonding in microelectronics
Harman, George G.
Wire bonding in microelectronics
[electronic resource] /George G. Harmon. - 3rd ed. - New York :McGraw-Hill,c2010. - xx, 426 p. :ill.
ISBN: 9780071476232
LCCN: 2010287045Subjects--Topical Terms:
670934
Semiconductors
--Failures.Index Terms--Genre/Form:
554714
Electronic books.
LC Class. No.: TK7836 / .H366 2010
Dewey Class. No.: 621.381
Wire bonding in microelectronics
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Click for full text (McGrawHill)
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