Record Type: |
Language materials, printed
: Monograph/item
|
Title/Author: |
晶圓代工與先進封裝產業科技實務/ 曲建仲作 |
Reminder of title: |
Wafer foundry and advanced package industry technology / |
remainder title: |
Wafer foundry and advanced package industry technology |
Author: |
曲建仲 |
Published: |
新北市 :全華, : 2023, |
Description: |
279面 :彩圖 : |
Notes: |
含索引 |
Subject: |
半導體 - |
Online resource: |
udn讀書館 |
ISBN: |
9786263284166 |