• 晶圓代工與先進封裝產業科技實務 = Wafer foundry and advanced package industry technology /
  • Record Type: Language materials, printed : Monograph/item
    Title/Author: 晶圓代工與先進封裝產業科技實務/ 曲建仲作
    Reminder of title: Wafer foundry and advanced package industry technology /
    remainder title: Wafer foundry and advanced package industry technology
    Author: 曲建仲
    Published: 新北市 :全華, : 2023,
    Description: 279面 :彩圖 :
    Notes: 含索引
    Subject: 半導體 -
    Online resource: udn讀書館
    ISBN: 9786263284166
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