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以雷射接合摻鈰釔鋁石榴石螢光陶瓷與鋁基板之界面結構探討 = = Stud...

許耀升

以雷射接合摻鈰釔鋁石榴石螢光陶瓷與鋁基板之界面結構探討 = = Study of the Interface Structure between Cerium-doped Yttrium Aluminum Garnet Phosphor Ceramics and Aluminum Substrate Joined by Laser /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	以雷射接合摻鈰釔鋁石榴石螢光陶瓷與鋁基板之界面結構探討 =/ 許耀升.
Reminder of title:	Study of the Interface Structure between Cerium-doped Yttrium Aluminum Garnet Phosphor Ceramics and Aluminum Substrate Joined by Laser /
remainder title:	Study of the Interface Structure between Cerium-doped Yttrium Aluminum Garnet Phosphor Ceramics and Aluminum Substrate Joined by Laser.
Author:	許耀升
Published:	雲林縣 :國立虎尾科技大學 , : 民113.08.,
Description:	[15], 88面 :圖, 表 ; : 30公分.;
Notes:	指導教授: 粘永堂.
Subject:	光纖雷射. -
Online resource:	電子資源

以雷射接合摻鈰釔鋁石榴石螢光陶瓷與鋁基板之界面結構探討 = = Study of the Interface Structure between Cerium-doped Yttrium Aluminum Garnet Phosphor Ceramics and Aluminum Substrate Joined by Laser /
許耀升

以雷射接合摻鈰釔鋁石榴石螢光陶瓷與鋁基板之界面結構探討 =Study of the Interface Structure between Cerium-doped Yttrium Aluminum Garnet Phosphor Ceramics and Aluminum Substrate Joined by Laser /Study of the Interface Structure between Cerium-doped Yttrium Aluminum Garnet Phosphor Ceramics and Aluminum Substrate Joined by Laser.許耀升. - 初版. - 雲林縣 :國立虎尾科技大學 ,民113.08. - [15], 88面 :圖, 表 ;30公分.

指導教授: 粘永堂.

碩士論文--國立虎尾科技大學材料科學與工程系材料科學與綠色能源工程碩士班.

含參考書目.

本研究利用光纖雷射接合鋁基板與摻鈰釔鋁石榴石，先利用鋁漿在鋁基板面塗佈鋁薄膜，再將摻鈰釔鋁石榴石與鋁基板搭接後，利用雷射對鋁基板鑽孔形成機械銷式的接合效果，為了確認光纖雷射鑽孔後的接合效果，本實驗分為鋁基板間接合與鋁基板接合摻鈰釔鋁石榴石螢光陶瓷，比較同質與異質材料的接合效果。以光學顯微鏡觀察不同參數下雷射鑽孔鋁基板間接合，可以發現在相同的加工時間3秒到6秒的參數下，雷射功率20 W與30 W，無法穿透厚度為0.5 mm的鋁基板，當雷射功率提升至40 W與50 W時，雷射可以穿透填料鋁漿，並對下方鋁基板做加工。以掃描式電子顯微鏡觀察雷射孔洞區域，在填料與上下鋁片的界面處出現鋁片與填料的混合物，以此判斷雷射過程中，熔化的鋁片與填料有部分會因雷射汽化，而有部分會因為反沖壓力凝固於填料與鋁片間的界面處，形成機械銷式的結構。參考鋁基板搭接的結果，使用功率40 W以上做為實驗參數，以掃描式電子顯微鏡分析，雷射孔洞深度約435 μm-990 μm，孔洞形貌呈不規則狀與尖錐狀，孔洞頂部的寬度約為116 μm-191 μm，以拉曼分析得知，雷射孔洞區域均為YAG相，經歸一化處理後得知3個孔洞分別位移1.13 cm-1、0.03 cm-1與0.06 cm-1判斷雷射熔化YAG:Ce後，因冷卻速率過快致使晶粒還未生長完成就凝固，導致晶格較為小。顯微光致發光分析，雷射孔洞區域黃光量高於SSR(solid state reaction)區域，測量雷射孔洞周圍發現，在雷射孔洞間的黃光量高於單一孔洞間的黃光量，因為在雷射加工的過程中，使加工區域周圍也會有熱能產生，這類似於退火的過程影響發光強度，將雷射孔洞數據歸一化處理後得知，雷射加工後均出現紅移，約為3.36nm-11.87 nm。.

(平裝)Subjects--Topical Terms:

1045712
光纖雷射.

以雷射接合摻鈰釔鋁石榴石螢光陶瓷與鋁基板之界面結構探討 = = Study of the Interface Structure between Cerium-doped Yttrium Aluminum Garnet Phosphor Ceramics and Aluminum Substrate Joined by Laser /
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100 1 $a 許耀升 $3 1448999
245 1 0 $a 以雷射接合摻鈰釔鋁石榴石螢光陶瓷與鋁基板之界面結構探討 = $b Study of the Interface Structure between Cerium-doped Yttrium Aluminum Garnet Phosphor Ceramics and Aluminum Substrate Joined by Laser / $c 許耀升.
246 1 1 $a Study of the Interface Structure between Cerium-doped Yttrium Aluminum Garnet Phosphor Ceramics and Aluminum Substrate Joined by Laser.
250 $a 初版.
260 # $a 雲林縣 : $b 國立虎尾科技大學 , $c 民113.08.
300 $a [15], 88面 : $b 圖, 表 ; $c 30公分.
500 $a 指導教授: 粘永堂.
500 $a 學年度: 112.
502 $a 碩士論文--國立虎尾科技大學材料科學與工程系材料科學與綠色能源工程碩士班.
504 $a 含參考書目.
520 3 $a 本研究利用光纖雷射接合鋁基板與摻鈰釔鋁石榴石，先利用鋁漿在鋁基板面塗佈鋁薄膜，再將摻鈰釔鋁石榴石與鋁基板搭接後，利用雷射對鋁基板鑽孔形成機械銷式的接合效果，為了確認光纖雷射鑽孔後的接合效果，本實驗分為鋁基板間接合與鋁基板接合摻鈰釔鋁石榴石螢光陶瓷，比較同質與異質材料的接合效果。以光學顯微鏡觀察不同參數下雷射鑽孔鋁基板間接合，可以發現在相同的加工時間3秒到6秒的參數下，雷射功率20 W與30 W，無法穿透厚度為0.5 mm的鋁基板，當雷射功率提升至40 W與50 W時，雷射可以穿透填料鋁漿，並對下方鋁基板做加工。以掃描式電子顯微鏡觀察雷射孔洞區域，在填料與上下鋁片的界面處出現鋁片與填料的混合物，以此判斷雷射過程中，熔化的鋁片與填料有部分會因雷射汽化，而有部分會因為反沖壓力凝固於填料與鋁片間的界面處，形成機械銷式的結構。參考鋁基板搭接的結果，使用功率40 W以上做為實驗參數，以掃描式電子顯微鏡分析，雷射孔洞深度約435 μm-990 μm，孔洞形貌呈不規則狀與尖錐狀，孔洞頂部的寬度約為116 μm-191 μm，以拉曼分析得知，雷射孔洞區域均為YAG相，經歸一化處理後得知3個孔洞分別位移1.13 cm-1、0.03 cm-1與0.06 cm-1判斷雷射熔化YAG:Ce後，因冷卻速率過快致使晶粒還未生長完成就凝固，導致晶格較為小。顯微光致發光分析，雷射孔洞區域黃光量高於SSR(solid state reaction)區域，測量雷射孔洞周圍發現，在雷射孔洞間的黃光量高於單一孔洞間的黃光量，因為在雷射加工的過程中，使加工區域周圍也會有熱能產生，這類似於退火的過程影響發光強度，將雷射孔洞數據歸一化處理後得知，雷射加工後均出現紅移，約為3.36nm-11.87 nm。.
520 3 $a This study utilizes fiber laser for bonding aluminum substrates with cerium-doped yttrium aluminum garnet (YAG:Ce) ceramics. Initially, aluminum paste is applied to the aluminum substrate surface to form a thin aluminum film. Subsequently, YAG:Ce is overlap onto the aluminum substrate, followed by laser drilling to achieve mechanically interlocked joints on the aluminum substrate. To assess the bonding efficacy post laser drilling, the experiment compares joints between aluminum substrates alone and those bonded with YAG:Ce, evaluating the bonding effectiveness of homogeneous and heterogeneous materials. Optical microscopy analysis of laser-drilled joints between aluminum substrates under various parameters reveals that at laser powers of 20 W and 30 W and processing durations ranging from 3 to 6 seconds, the laser fails to penetrate the 0.5 mm thick aluminum substrate. However, at higher powers of 40 W and 50 W, the laser successfully penetrates the aluminum paste filler and processes the underlying aluminum substrate. Scanning electron microscopy (SEM) examination of the laser-drilled hole regions reveals a mixture of aluminum and filler material at the interface between the filler and the upper/lower aluminum layers, indicating that during the laser process, melted aluminum and filler material partly vaporize due to the laser's energy and solidify under recoil pressure at the interface, thereby forming a mechanically interlocked structure. Based on the results of the aluminum substrate bonding, experimental parameters of 40 W and above are selected. SEM analysis indicates that laser-drilled hole depths range from approximately 435 μm to 990 μm, exhibiting irregular and conical shapes. The top widths of the holes measure approximately 116 μm to 191 μm. Raman spectroscopy confirms that the laser-drilled hole regions consist entirely of the YAG phase. Normalization of the Raman spectra reveals shifts of 1.13 cm-1, 0.03 cm-1, and 0.06 cm-1, indicating that rapid cooling following laser melting of YAG results in grain expansion before complete crystallization. Micro-photoluminescence analysis demonstrates higher yellow light emission in the laser-drilled hole areas compared to regions processed by solid-state reaction (SSR). Measurements around the laser-drilled holes indicate that yellow light emission between holes is higher than within individual holes, suggesting peripheral thermal energy generation during laser processing, akin to annealing effects, impacting luminescence intensity. Normalization of laser-drilled hole data reveals a red shift of approximately 3.36 nm to 11.87 nm post laser processing..
563 $a (平裝)
650 # 4 $a 光纖雷射. $3 1045712
650 # 4 $a 釔鋁石榴石. $3 1383688
650 # 4 $a 異質接合. $3 1253172
650 # 4 $a 顯微光致發光. $3 1450682
650 # 4 $a fiber laser. $3 1128695
650 # 4 $a yttrium aluminum garnet. $3 1383691
650 # 4 $a heterogeneous joining. $3 1450683
650 # 4 $a micro-photoluminescence. $3 1450684
856 7 # $u https://handle.ncl.edu.tw/11296/96m678 $z 電子資源 $2 http