國立虎尾科技大學 |

Advanced liquid metal cooling for chip, device and system

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Advanced liquid metal cooling for chip, device and system/ Jing Liu.
作者:	Liu, Jing,
出版者:	Singapore ;World Scientific, : c2022.,
面頁冊數:	1 online resource :ill. :
標題:	Heat exchangers. -
電子資源:	https://www.worldscientific.com/worldscibooks/10.1142/12517#t=toc
ISBN:	9789811245862

Advanced liquid metal cooling for chip, device and system
Liu, Jing,1969-

Advanced liquid metal cooling for chip, device and system[electronic resource] /Jing Liu. - 1st ed. - Singapore ;World Scientific,c2022. - 1 online resource :ill.

Includes bibliographical references and index.

"This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category--liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system. With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry"--

ISBN: 9789811245862

LCCN: 2021046877Subjects--Topical Terms:

559160
Heat exchangers.

LC Class. No.: TK7870.25 / .L48 2022

Dewey Class. No.: 621.381

Advanced liquid metal cooling for chip, device and system
LDR:01672cam a2200277 a 4500 001 1136068
005 20240923072503.0
006 m o d
007 cr cnu---unuuu
008 241218s2022 si a ob 001 0 eng
010 $a 2021046877
020 $a 9789811245862 $q (ebook)
020 $a 9789811245879 $q (ebook for individuals)
020 $z 9789811245855 $q (hardcover)
035 $a 22248276
040 $a DLC $b eng $c DLC $d DLC
041 0 $a eng
050 0 0 $a TK7870.25 $b .L48 2022
082 0 0 $a 621.381 $2 23
100 1 $a Liu, Jing, $d 1969- $3 1458237
245 1 0 $a Advanced liquid metal cooling for chip, device and system $h [electronic resource] / $c Jing Liu.
250 $a 1st ed.
260 $a Singapore ; $a Hackensack, NJ : $b World Scientific, $c c2022.
300 $a 1 online resource : $b ill.
504 $a Includes bibliographical references and index.
520 $a "This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category--liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system. With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry"-- $c Provided by publisher.
588 $a Description based on print version record.
650 0 $a Heat exchangers. $3 559160
650 0 $a Thermofluids. $3 1338516
650 0 $a Liquid metals $x Thermal properties. $3 1458239
650 0 $a Liquid metal heat transfer. $3 1458238
650 0 $a Electronic apparatus and appliances $x Cooling. $3 886075
856 4 0 $u https://www.worldscientific.com/worldscibooks/10.1142/12517#t=toc