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Design of Substrate Integrated Waveguide Filter Structures.

紀錄類型:	書目-語言資料,手稿 : Monograph/item
正題名/作者:	Design of Substrate Integrated Waveguide Filter Structures./
作者:	Toffel, Ryan.
面頁冊數:	1 online resource (73 pages)
附註:	Source: Masters Abstracts International, Volume: 85-06.
Contained By:	Masters Abstracts International85-06.
標題:	Electrical engineering. -
電子資源:	click for full text (PQDT)
ISBN:	9798381154474

Design of Substrate Integrated Waveguide Filter Structures.
Toffel, Ryan.

Design of Substrate Integrated Waveguide Filter Structures. - 1 online resource (73 pages)

Source: Masters Abstracts International, Volume: 85-06.

Thesis (M.S.)--University of Colorado Colorado Springs, 2023.

Includes bibliographical references

With the realization of next generation wireless networks (5G and 6G), highly integrated microwave modules are becoming more complex. Within a microwave module, the interconnect technology is used to integrate various components into a functional system. This includes not only the careful design of controlled impedance transmission lines, but also microwave circuits (such as filters, power dividers, and couplers). The interconnect is usually some form of multilayer technology such as a standard multi-layer printed circuit board (PCB), or a collection multi-layer planar structures connected to one another with wire-bonds. For frequencies above 20 GHz, the performance of the interconnecting structures is in the critical path, and methods of balancing cost, manufacturability, and performance become a large design hurdle. As manufacturing capabilities increase, Substrate integrated waveguide (SIW) interconnects are becoming more viable in the design of microwave modules. The increase in conductor surface area used by the propagating modes in a SIW allows for lower loss interconnects (and high Q-factor resonate structures) within a standard multi-layer process. When paired with the current low-loss dielectrics (e.g. Tachyon 100G), SIW circuits are a viable, low cost method of interconnecting and integrating a microwave system.In this research, the design of SIW filters operating in the K (18 - 27 GHz) and Ka (27 - 40 GHz) bands is explored in detail. Analysis techniques for impedance inverters are proposed, and the impact of parasitic elements on filter performance are demonstrated. A novel SIW surface mount diplexer is designed to operate on the 24 GHz and 28 GHz bands used for 5G MIMO applications. The diplexer is manufactured on an Alumina substrate, with an emphasis compactness and low loss. The prototype diplexer is built and measured to verify the manufacturability and electrical performance.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2024

Mode of access: World Wide Web

ISBN: 9798381154474Subjects--Topical Terms:

596380
Electrical engineering.
Subjects--Index Terms:

DiplexerIndex Terms--Genre/Form:

554714
Electronic books.

Design of Substrate Integrated Waveguide Filter Structures.
LDR:03257ntm a22003857 4500 001 1142143
005 20240414211957.5
006 m o d
007 cr mn ---uuuuu
008 250605s2023 xx obm 000 0 eng d
020 $a 9798381154474
035 $a (MiAaPQ)AAI30817069
035 $a AAI30817069
040 $a MiAaPQ $b eng $c MiAaPQ $d NTU
100 1 $a Toffel, Ryan. $3 1466355
245 1 0 $a Design of Substrate Integrated Waveguide Filter Structures.
264 0 $c 2023
300 $a 1 online resource (73 pages)
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
500 $a Source: Masters Abstracts International, Volume: 85-06.
500 $a Advisor: Kalkur, Thottam S.
502 $a Thesis (M.S.)--University of Colorado Colorado Springs, 2023.
504 $a Includes bibliographical references
520 $a With the realization of next generation wireless networks (5G and 6G), highly integrated microwave modules are becoming more complex. Within a microwave module, the interconnect technology is used to integrate various components into a functional system. This includes not only the careful design of controlled impedance transmission lines, but also microwave circuits (such as filters, power dividers, and couplers). The interconnect is usually some form of multilayer technology such as a standard multi-layer printed circuit board (PCB), or a collection multi-layer planar structures connected to one another with wire-bonds. For frequencies above 20 GHz, the performance of the interconnecting structures is in the critical path, and methods of balancing cost, manufacturability, and performance become a large design hurdle. As manufacturing capabilities increase, Substrate integrated waveguide (SIW) interconnects are becoming more viable in the design of microwave modules. The increase in conductor surface area used by the propagating modes in a SIW allows for lower loss interconnects (and high Q-factor resonate structures) within a standard multi-layer process. When paired with the current low-loss dielectrics (e.g. Tachyon 100G), SIW circuits are a viable, low cost method of interconnecting and integrating a microwave system.In this research, the design of SIW filters operating in the K (18 - 27 GHz) and Ka (27 - 40 GHz) bands is explored in detail. Analysis techniques for impedance inverters are proposed, and the impact of parasitic elements on filter performance are demonstrated. A novel SIW surface mount diplexer is designed to operate on the 24 GHz and 28 GHz bands used for 5G MIMO applications. The diplexer is manufactured on an Alumina substrate, with an emphasis compactness and low loss. The prototype diplexer is built and measured to verify the manufacturability and electrical performance.
533 $a Electronic reproduction. $b Ann Arbor, Mich. : $c ProQuest, $d 2024
538 $a Mode of access: World Wide Web
650 4 $a Electrical engineering. $3 596380
650 4 $a Electromagnetics. $3 1178899
650 4 $a Computer engineering. $3 569006
653 $a Diplexer
653 $a Impedance inverters
653 $a Substrate integrated waveguide
653 $a Printed circuit board
655 7 $a Electronic books. $2 local $3 554714
690 $a 0544
690 $a 0607
690 $a 0464
710 2 $a ProQuest Information and Learning Co. $3 1178819
710 2 $a University of Colorado Colorado Springs. $b College of Engineering and Applied Science-Electrical Engineering. $3 1187079
773 0 $t Masters Abstracts International $g 85-06.
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=30817069 $z click for full text (PQDT)