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Thermal Design on a Radio Frequency Board Using Mathematical Programming.

Record Type:	Language materials, manuscript : Monograph/item
Title/Author:	Thermal Design on a Radio Frequency Board Using Mathematical Programming./
Author:	Montanez, Roberto.
Description:	1 online resource (96 pages)
Notes:	Source: Dissertations Abstracts International, Volume: 85-06, Section: B.
Contained By:	Dissertations Abstracts International85-06B.
Subject:	Mechanical engineering. -
Online resource:	click for full text (PQDT)
ISBN:	9798381144734

Thermal Design on a Radio Frequency Board Using Mathematical Programming.
Montanez, Roberto.

Thermal Design on a Radio Frequency Board Using Mathematical Programming. - 1 online resource (96 pages)

Source: Dissertations Abstracts International, Volume: 85-06, Section: B.

Thesis (D.Engr.)--The George Washington University, 2024.

Includes bibliographical references

The design of radio frequency boards may be under the purview of an engineering manager, or the boards may be instrumental to a larger project overseen by an engineering manager. Regardless, the optimal design is essential to engineering managers. In this research, we use mathematical programming and genetic algorithm to find the optimal values for design parameters that affect a high power amplifier's target junction temperature, Tj, subjected to a transient power condition and stack-up configurations. This research considers period, duty, board thickness, and the number of vias as the parameters that affect the component's Tj. This work assumes a high power amplifier component soldered to a ceramic board. The board's bottom face transfers the heat to an ambient temperature of 25oC via forced convection. This study compared the solutions to a finite element model for validation purposes. For a target, Tj of 150oC and assuming a power dissipation of 15 W, the optimal values obtained using mathematical programming were 15.49 seconds for the period, 43.4% for the duty, 0.091 inches for the board thickness, and 40 as the number of vias in the ceramic. The optimal parameters were used as inputs in a Finite Element Model (FEM) model for validation purposes and the solution error found was 0.5%. This research demonstrates that applying mathematical programming is an effective and reliable method to define parameters in radio frequency board design.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2024

Mode of access: World Wide Web

ISBN: 9798381144734Subjects--Topical Terms:

557493
Mechanical engineering.
Subjects--Index Terms:

Electronics coolingIndex Terms--Genre/Form:

554714
Electronic books.

Thermal Design on a Radio Frequency Board Using Mathematical Programming.
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504 $a Includes bibliographical references
520 $a The design of radio frequency boards may be under the purview of an engineering manager, or the boards may be instrumental to a larger project overseen by an engineering manager. Regardless, the optimal design is essential to engineering managers. In this research, we use mathematical programming and genetic algorithm to find the optimal values for design parameters that affect a high power amplifier's target junction temperature, Tj, subjected to a transient power condition and stack-up configurations. This research considers period, duty, board thickness, and the number of vias as the parameters that affect the component's Tj. This work assumes a high power amplifier component soldered to a ceramic board. The board's bottom face transfers the heat to an ambient temperature of 25oC via forced convection. This study compared the solutions to a finite element model for validation purposes. For a target, Tj of 150oC and assuming a power dissipation of 15 W, the optimal values obtained using mathematical programming were 15.49 seconds for the period, 43.4% for the duty, 0.091 inches for the board thickness, and 40 as the number of vias in the ceramic. The optimal parameters were used as inputs in a Finite Element Model (FEM) model for validation purposes and the solution error found was 0.5%. This research demonstrates that applying mathematical programming is an effective and reliable method to define parameters in radio frequency board design.
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653 $a Optimization
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