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A thermodynamic and experimental determination of the copper-indium-lead ternary phase diagram.

紀錄類型:	書目-語言資料,手稿 : Monograph/item
正題名/作者:	A thermodynamic and experimental determination of the copper-indium-lead ternary phase diagram./
作者:	Bolcavage, Ann.
面頁冊數:	1 online resource (233 pages)
附註:	Source: Dissertations Abstracts International, Volume: 76-02, Section: B.
Contained By:	Dissertations Abstracts International76-02B.
標題:	Metallurgy. -
電子資源:	click for full text (PQDT)
ISBN:	9798209389712

A thermodynamic and experimental determination of the copper-indium-lead ternary phase diagram.
Bolcavage, Ann.

A thermodynamic and experimental determination of the copper-indium-lead ternary phase diagram. - 1 online resource (233 pages)

Source: Dissertations Abstracts International, Volume: 76-02, Section: B.

Thesis (Ph.D.)--The University of Wisconsin - Madison, 1994.

Includes bibliographical references

The C-4 microelectronic interconnection technology is briefly reviewed, and the inherent advantages of using lead-indium solder in this packaging scheme are considered. A case is then made for evaluating the Cu-In-Pb ternary phase diagram, based on the prevalence of copper in current packaging technology and a lack of satisfactory data on the metallurgical interactions between copper and lead-indium. The literature pertaining to the constituent binary diagrams in this system is reviewed, with determinations made on the validity of some temperature-composition and thermodynamic values. This data is then used to calculate these same binary phase diagrams, and the parameters within describing the excess Gibbs excess free energy of the phases are extrapolated to determine the first order Cu-In-Pb ternary phase diagram. The first order model provides a reasonable estimate of the topology and serves as a guide to efficient experimentation. Predicted isothermal and isoplethal sections, as well as invariant reaction temperatures, are compared with those determined by experimental methods, namely DSC/DTA and EPMA. The experimental results indicate where adjustment to the thermodynamic parameters is necessary. Optimization of these parameters is achieved by inserting the relevant experimental data into a least-squares calculation, so that the discrepancy between calculated and experimental values are minimized. The final phase diagram, recalculated with the optimized parameters, is once again compared with the experimental data to verify that it more closely reflects the phase equilibria proposed by the experimental investigation. Finally, uses in microelectronics packaging and diffusion studies for the various calculated sections and liquidus projections of the Cu-In-Pb phase diagram are presented.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2024

Mode of access: World Wide Web

ISBN: 9798209389712Subjects--Topical Terms:

815859
Metallurgy.
Subjects--Index Terms:

copper-indium-leadIndex Terms--Genre/Form:

554714
Electronic books.

A thermodynamic and experimental determination of the copper-indium-lead ternary phase diagram.
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504 $a Includes bibliographical references
520 $a The C-4 microelectronic interconnection technology is briefly reviewed, and the inherent advantages of using lead-indium solder in this packaging scheme are considered. A case is then made for evaluating the Cu-In-Pb ternary phase diagram, based on the prevalence of copper in current packaging technology and a lack of satisfactory data on the metallurgical interactions between copper and lead-indium. The literature pertaining to the constituent binary diagrams in this system is reviewed, with determinations made on the validity of some temperature-composition and thermodynamic values. This data is then used to calculate these same binary phase diagrams, and the parameters within describing the excess Gibbs excess free energy of the phases are extrapolated to determine the first order Cu-In-Pb ternary phase diagram. The first order model provides a reasonable estimate of the topology and serves as a guide to efficient experimentation. Predicted isothermal and isoplethal sections, as well as invariant reaction temperatures, are compared with those determined by experimental methods, namely DSC/DTA and EPMA. The experimental results indicate where adjustment to the thermodynamic parameters is necessary. Optimization of these parameters is achieved by inserting the relevant experimental data into a least-squares calculation, so that the discrepancy between calculated and experimental values are minimized. The final phase diagram, recalculated with the optimized parameters, is once again compared with the experimental data to verify that it more closely reflects the phase equilibria proposed by the experimental investigation. Finally, uses in microelectronics packaging and diffusion studies for the various calculated sections and liquidus projections of the Cu-In-Pb phase diagram are presented.
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