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The Electromigration Behavior of the SnBi System : = Implications for the Reliability of Low Temperature Solder Joints.

紀錄類型:	書目-語言資料,手稿 : Monograph/item
正題名/作者:	The Electromigration Behavior of the SnBi System :/
其他題名:	Implications for the Reliability of Low Temperature Solder Joints.
作者:	Hadian, Faramarz.
面頁冊數:	1 online resource (141 pages)
附註:	Source: Dissertations Abstracts International, Volume: 82-10, Section: B.
Contained By:	Dissertations Abstracts International82-10B.
標題:	Materials science. -
電子資源:	click for full text (PQDT)
ISBN:	9798597075648

The Electromigration Behavior of the SnBi System : = Implications for the Reliability of Low Temperature Solder Joints.
Hadian, Faramarz.

The Electromigration Behavior of the SnBi System :Implications for the Reliability of Low Temperature Solder Joints. - 1 online resource (141 pages)

Source: Dissertations Abstracts International, Volume: 82-10, Section: B.

Thesis (Ph.D.)--State University of New York at Binghamton, 2020.

Includes bibliographical references

Modern microelectronics depends upon interconnects between devices which are relatively small. Metallizations (such as W/Cu/Ni thin film layers) are added to semiconductor devices, and these metallization are joined with small volumes of Sn based alloys (solder joints), between 30 and 300 micron in diameter, in order to connect devices. Joining typically occurs by melting and solidifying the Sn based solder in contact with the metallizations. To optimize such processes, and associated microelectronic interconnect properties, an understanding of the associated phase diagrams and atomic mobilities must be established, and carefully implemented. Some surprising phenomena are inevitably encountered, particularly with a new system, such as the low temperature, near eutectic Sn-Bi solder system, which are currently being introduced into the world of microelectronics. Thus we studied solidification of Sn-Bi solder joints, and atomic diffusion of Bi in Sn, as well as diffusion in related metallizations. We examined the effect of thermal history and initial volume ratio on the distribution of Bi atoms in SnAgCu/BiSnAg mixed solder joints. Near eutectic BiSnAg was melted in contact with solid, near eutectic SnAgCu. The variation in SnBiAg volume as a function of processing parameters was characterized, and compared to results from a simple model based upon the Sn-Bi phase diagram. In addition, standard solidification theory was utilized to predict the Bi distribution in the SnBiAg, as a function of position. That is to say, a large gradient in the concentration of Bi in the SnBiAg region after solidification was analyzed using the Scheil equation. Diffusion of Bi in the solidified SnAgCu/BiSnAg samples was studied as a function of time, temperature and applied electric field strength. The effects of both heat treatment and electromigration were analyzed using a classic solution of Fick's second law for a one-dimensional, semi-infinite diffusion couple. Thus, values of the diffusion coefficient of Bi in Sn, and the product of diffusion coefficient and effective charge number, DZ*, for Bi atoms undergoing electromigration in Sn, were reported.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2024

Mode of access: World Wide Web

ISBN: 9798597075648Subjects--Topical Terms:

557839
Materials science.
Subjects--Index Terms:

Concentration gradientIndex Terms--Genre/Form:

554714
Electronic books.

The Electromigration Behavior of the SnBi System : = Implications for the Reliability of Low Temperature Solder Joints.
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