國立虎尾科技大學 |

Modeling Thermosyphon and Heat Pipe Performance for Mold Cooling Applications.

Record Type:	Language materials, manuscript : Monograph/item
Title/Author:	Modeling Thermosyphon and Heat Pipe Performance for Mold Cooling Applications./
Author:	Sarkar, Dwaipayan.
Description:	1 online resource (372 pages)
Notes:	Source: Dissertations Abstracts International, Volume: 85-11, Section: B.
Contained By:	Dissertations Abstracts International85-11B.
Subject:	Industrial engineering. -
Online resource:	click for full text (PQDT)
ISBN:	9798382232560

Modeling Thermosyphon and Heat Pipe Performance for Mold Cooling Applications.
Sarkar, Dwaipayan.

Modeling Thermosyphon and Heat Pipe Performance for Mold Cooling Applications. - 1 online resource (372 pages)

Source: Dissertations Abstracts International, Volume: 85-11, Section: B.

Thesis (Ph.D.)--The University of Western Ontario (Canada), 2024.

Includes bibliographical references

Thermosyphons are enhanced heat transfer devices that can continuously transfer very large amounts of heat rapidly over long distances with small temperature differences. The high heat transfer rate is achieved through simultaneous boiling and condensation of the working fluid and the continuous heat transfer is achieved through recirculation of the working fluid in its liquid and vapor phase. A potentially important application of the thermosyphons has been towards reducing the cycle times of the mold cooling processes which would provide economic incentives to the automotive industry. Different operational and geometrical parameters such as the input heating power, fill ratio (FR), aspect ratio (AR) and orientation influence the thermodynamic state of the working fluid and the boiling and condensation thermal resistances. The goal of the present work is to develop a more rigorous understanding of the thermal performance of thermosyphons as a function of their design parameters and operating conditions. A thermodynamic model is developed to predict the thermodynamic state of the working fluid and its related properties inside a thermosyphon and heat pipe at each stage of the thermodynamic cycle. The model can predict the operating temperature of a thermosyphon and a heat pipe under a given geometrical and operating condition. The existing predictive heat transfer correlations for estimating the boiling and condensation thermal resistances for thermosyphons are inadequate and lack consistency. Using non-dimensional analysis based on the Buckingham-pi theorem, a series of analytical expressions capable of predicting the boiling and condensation thermal resistance under different operational parameters are developed. The thermal performance of ten distilled-water copper thermosyphons is experimentally investigated by varying the input heating power between 6.68 [W] and 32.98 [W], fill ratio between 0.35 - 0.75 and aspect ratio between 5.33 and 12.43 to understand the relationship between these operating parameters and the boiling and condensation thermal resistances. The present experimental data when compared to the new thermal resistance expressions showed excellent agreement (± 15%). The previous experimental data, however, showed a slightly worse agreement (± 30%), which could be attributed to the overall energy balance and the uncertainties in the reported fill ratio. The results from this work can be useful for selecting thermosyphons for specific applications and optimize the existing design of thermosyphons.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2024

Mode of access: World Wide Web

ISBN: 9798382232560Subjects--Topical Terms:

679492
Industrial engineering.
Subjects--Index Terms:

ThermosyphonsIndex Terms--Genre/Form:

554714
Electronic books.

Modeling Thermosyphon and Heat Pipe Performance for Mold Cooling Applications.
LDR:04002ntm a22003977 4500 001 1147754
005 20240916065500.5
006 m o d
007 cr bn ---uuuuu
008 250605s2024 xx obm 000 0 eng d
020 $a 9798382232560
035 $a (MiAaPQ)AAI31272777
035 $a (MiAaPQ)oaiirlibuwocaetd12807
035 $a AAI31272777
040 $a MiAaPQ $b eng $c MiAaPQ $d NTU
100 1 $a Sarkar, Dwaipayan. $3 1473561
245 1 0 $a Modeling Thermosyphon and Heat Pipe Performance for Mold Cooling Applications.
264 0 $c 2024
300 $a 1 online resource (372 pages)
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
500 $a Source: Dissertations Abstracts International, Volume: 85-11, Section: B.
500 $a Advisor: DeGroot, Christopher;Savory, Eric.
502 $a Thesis (Ph.D.)--The University of Western Ontario (Canada), 2024.
504 $a Includes bibliographical references
520 $a Thermosyphons are enhanced heat transfer devices that can continuously transfer very large amounts of heat rapidly over long distances with small temperature differences. The high heat transfer rate is achieved through simultaneous boiling and condensation of the working fluid and the continuous heat transfer is achieved through recirculation of the working fluid in its liquid and vapor phase. A potentially important application of the thermosyphons has been towards reducing the cycle times of the mold cooling processes which would provide economic incentives to the automotive industry. Different operational and geometrical parameters such as the input heating power, fill ratio (FR), aspect ratio (AR) and orientation influence the thermodynamic state of the working fluid and the boiling and condensation thermal resistances. The goal of the present work is to develop a more rigorous understanding of the thermal performance of thermosyphons as a function of their design parameters and operating conditions. A thermodynamic model is developed to predict the thermodynamic state of the working fluid and its related properties inside a thermosyphon and heat pipe at each stage of the thermodynamic cycle. The model can predict the operating temperature of a thermosyphon and a heat pipe under a given geometrical and operating condition. The existing predictive heat transfer correlations for estimating the boiling and condensation thermal resistances for thermosyphons are inadequate and lack consistency. Using non-dimensional analysis based on the Buckingham-pi theorem, a series of analytical expressions capable of predicting the boiling and condensation thermal resistance under different operational parameters are developed. The thermal performance of ten distilled-water copper thermosyphons is experimentally investigated by varying the input heating power between 6.68 [W] and 32.98 [W], fill ratio between 0.35 - 0.75 and aspect ratio between 5.33 and 12.43 to understand the relationship between these operating parameters and the boiling and condensation thermal resistances. The present experimental data when compared to the new thermal resistance expressions showed excellent agreement (± 15%). The previous experimental data, however, showed a slightly worse agreement (± 30%), which could be attributed to the overall energy balance and the uncertainties in the reported fill ratio. The results from this work can be useful for selecting thermosyphons for specific applications and optimize the existing design of thermosyphons.
533 $a Electronic reproduction. $b Ann Arbor, Mich. : $c ProQuest, $d 2024
538 $a Mode of access: World Wide Web
650 4 $a Industrial engineering. $3 679492
650 4 $a Thermodynamics. $3 596513
653 $a Thermosyphons
653 $a Heat pipes
653 $a Buckingham pi-theorem
653 $a Copper thermosyphon
653 $a Thermal resistance
655 7 $a Electronic books. $2 local $3 554714
690 $a 0546
690 $a 0348
710 2 $a ProQuest Information and Learning Co. $3 1178819
710 2 $a The University of Western Ontario (Canada). $3 1184598
773 0 $t Dissertations Abstracts International $g 85-11B.
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=31272777 $z click for full text (PQDT)