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Thermal management materials for electronic packaging = preparation, characterization, and devices /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Thermal management materials for electronic packaging/ edited by Xingyou Tian.
Reminder of title:	preparation, characterization, and devices /
other author:	Tian, Xingyou.
Published:	Weinheim, Germany :Wiley-VCH, : c2024.,
Description:	1 online resource (362 p.) :ill. :
Subject:	Materials science. -
Online resource:	https://onlinelibrary.wiley.com/doi/book/10.1002/9783527843121
ISBN:	9783527843121

Thermal management materials for electronic packaging = preparation, characterization, and devices /
Thermal management materials for electronic packagingpreparation, characterization, and devices /[electronic resource] :edited by Xingyou Tian. - 1st ed. - Weinheim, Germany :Wiley-VCH,c2024. - 1 online resource (362 p.) :ill.

Includes bibliographical references and index.

Chapter 1 Physical Basis of Thermal Conduction -- Chapter 2 Electronic Packaging Materials for Thermal Management -- Chapter 3 Characterization Methods for Thermal Management Materials -- Chapter 4 Construction of Thermal Conductivity Network and Performance Optimization of Polymer Substrate -- Chapter 5 Optimal Design of High Thermal Conductive Metal Substrate System for High‐Power Devices -- Chapter 6 Preparation and Performance Study of Silicon Nitride Ceramic Substrate with High Thermal Conductivity -- Chapter 7 Preparation and Properties of Thermal Interface Materials.

Thermal Management Materials for Electronic Packaging Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance. The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area. Sample topics covered in Thermal Management Materials for Electronic Packaging include: Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation Thermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.

ISBN: 9783527843121Subjects--Topical Terms:

557839
Materials science.

LC Class. No.: TA403 / .T447 2024

Dewey Class. No.: 780

Thermal management materials for electronic packaging = preparation, characterization, and devices /
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520 $a Thermal Management Materials for Electronic Packaging Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance. The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area. Sample topics covered in Thermal Management Materials for Electronic Packaging include: Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation Thermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.
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