| Record Type: |
Language materials, printed
: Monograph/item
|
| Title/Author: |
晶圓代工與先進封裝產業科技實務/ 曲建仲作. |
| Reminder of title: |
Wafer foundry and advanced packaging technologies : industrial practices and applications / |
| remainder title: |
Wafer foundry and advanced packaging technologies : |
| Author: |
曲建仲. |
| Published: |
[臺北市] :知識力科技 ; : 2025[民114]., |
| Description: |
294面 :彩圖, 表. : |
| Notes: |
資料型式 : 文字 |
| Subject: |
半導體 - |
| Online resource: |
HyRead ebook電子書 |
| ISBN: |
9786264015738 |