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Silicon Wafer Bonding Technology : F...
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INSPEC (Information service)
Silicon Wafer Bonding Technology : For VLSI and MEMS Applications
Record Type:
Language materials, printed : monographic
Title Information:
For VLSI and MEMS Applications
Secondary Intellectual Responsibility:
IyerSubramanian S,
Secondary Intellectual Responsibility:
Auberton-HerveAndre J,
Alternative Intellectual Responsibility:
Institution of Electrical Engineers
Place of Publication:
London
Published:
Institution of Electrical Engineers; Institution of Electrical Engineers;
Year of Publication:
c2002
Description:
xxv, 149 pill : 25 cm;
Series:
Subject:
Silicon-on-insulator technology -
Subject:
Integrated circuits - Very large scale integration -
Subject:
Microelectromechanical systems -
ISBN:
0852960395
Silicon Wafer Bonding Technology : For VLSI and MEMS Applications
Silicon Wafer Bonding Technology
: For VLSI and MEMS Applications / edited by Subramanian S. Iyer and Andre J. Auberton-Herve - London : Institution of Electrical Engineers, c2002. - xxv, 149 p ; ill ; 25 cm. - ( ; no. 1).
Includes bibliographical references and index.
ISBN 0852960395
Silicon-on-insulator technologyIntegrated circuitsMicroelectromechanical systems -- Very large scale integration
Iyer, Subramanian S
Silicon Wafer Bonding Technology : For VLSI and MEMS Applications
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虎尾科技大學圖書館
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20070124
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E027050
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