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Tribology of abrasive machining processes

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Tribology of abrasive machining processes/ Ioan D. Marinescu ... [et al.].
other author:	Marinescu, Ioan D.
Published:	Norwich, NY :William Andrew Pub., : c2004.,
Description:	xxvii, 724 p. :ill. ; : 24 cm.;
Subject:	Tribology. -
Online resource:	An electronic book accessible through the World Wide Web; click for information
ISBN:	9780815514909 (paper)

Tribology of abrasive machining processes
Tribology of abrasive machining processes[electronic resource] /Ioan D. Marinescu ... [et al.]. - Norwich, NY :William Andrew Pub.,c2004. - xxvii, 724 p. :ill. ;24 cm.

Includes bibliographical references and index.

Introduction to Abrasive Processes -- Tribosystems of Abrasive Machining Processes -- Kinematic Models of Abrasive Contacts -- Contact Mechanics -- Forces, Friction, and Energy -- Thermal Design of Processes -- Molecular Dynamics for Abrasive Process Simulation -- Fluid Delivery -- Electrolytic In-Process Dressing (ELID) Grinding and Polishing -- Grinding Wheel and Abrasive Topography -- Abrasives and Abrasive Tools -- Conditioning of Abrasive Wheels -- Loose Abrasive Processes -- Process Fluids for Abrasive Machining -- Tribology of Abrasive Machining -- Processed Materials.

Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors.

Electronic reproduction.
Amsterdam :
Elsevier Science & Technology,
2008.

Mode of access: World Wide Web.

ISBN: 9780815514909 (paper)Subjects--Topical Terms:

592076
Tribology.
Index Terms--Genre/Form:

554714
Electronic books.

LC Class. No.: TJ1280 / .T68 2004eb

Dewey Class. No.: 621.8/9

Tribology of abrasive machining processes
LDR:02590cam a22002654a 4500 001 644795
003 OCoLC
005 20100518081709.0
006 m d
007 cr cn
008 100601s2004 nyua sb 001 0 eng d
020 $a 9780815514909 (paper)
020 $a 0815514905 (paper)
035 $a (OCoLC)281606798
035 $a ocn281606798
040 $a OPELS $b eng $c OPELS $d OPELS
050 1 4 $a TJ1280 $b .T68 2004eb
082 0 4 $a 621.8/9 $2 22
245 0 0 $a Tribology of abrasive machining processes $h [electronic resource] / $c Ioan D. Marinescu ... [et al.].
260 $a Norwich, NY : $c c2004. $b William Andrew Pub.,
300 $a xxvii, 724 p. : $b ill. ; $c 24 cm.
504 $a Includes bibliographical references and index.
505 0 $a Introduction to Abrasive Processes -- Tribosystems of Abrasive Machining Processes -- Kinematic Models of Abrasive Contacts -- Contact Mechanics -- Forces, Friction, and Energy -- Thermal Design of Processes -- Molecular Dynamics for Abrasive Process Simulation -- Fluid Delivery -- Electrolytic In-Process Dressing (ELID) Grinding and Polishing -- Grinding Wheel and Abrasive Topography -- Abrasives and Abrasive Tools -- Conditioning of Abrasive Wheels -- Loose Abrasive Processes -- Process Fluids for Abrasive Machining -- Tribology of Abrasive Machining -- Processed Materials.
520 $a Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors.
533 $a Electronic reproduction. $b Amsterdam : $c Elsevier Science & Technology, $d 2008. $n Mode of access: World Wide Web. $n System requirements: Web browser. $n Title from title screen (viewed on Dec. 9, 2008). $n Access may be restricted to users at subscribing institutions.
650 0 $a Tribology. $3 592076
650 0 $a Grinding and polishing. $3 712634
655 7 $a Electronic books. $2 local $3 554714
700 1 $a Marinescu, Ioan D. $3 712635
710 2 $a ScienceDirect (Online service) $3 636041
856 4 0 $3 ScienceDirect $u http://www.sciencedirect.com/science/book/9780815514909 $z An electronic book accessible through the World Wide Web; click for information