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Practical Guide to the Packaging of ...

Ebooks Corporation.

Practical Guide to the Packaging of Electronics : = Thermal and Mechanical Design and Analysis.

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Practical Guide to the Packaging of Electronics :/
Reminder of title:	Thermal and Mechanical Design and Analysis.
Author:	Jamnia, Ali.
Published:	Hoboken :Taylor & Francis Ltd, : 2008.,
Description:	336 p.
Subject:	Electronic packaging. -
Online resource:	http://www.crcnetbase.com/doi/book/10.1201/9781420065404
ISBN:	9781420065312 (electronic bk.)

Practical Guide to the Packaging of Electronics : = Thermal and Mechanical Design and Analysis.
Jamnia, Ali.

Practical Guide to the Packaging of Electronics :Thermal and Mechanical Design and Analysis.[electronic resource]. - 2nd ed. - Hoboken :Taylor & Francis Ltd,2008. - 336 p. - Dekker Mechanical Engineering, v. 146. - Dekker Mechanical Engineering, v. 146..

Presents a basic understanding of the issues that concern the field of electronics packaging. This work discusses topics including various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; and, mechanical, electrical and chemically induced reliability.

Electronic reproduction.

Available via World Wide Web.

Mode of access: World Wide Web.

ISBN: 9781420065312 (electronic bk.)Subjects--Topical Terms:

556061
Electronic packaging.
Index Terms--Genre/Form:

554714
Electronic books.

LC Class. No.: TK7870.15.J36 2009

Dewey Class. No.: 621.381046

Practical Guide to the Packaging of Electronics : = Thermal and Mechanical Design and Analysis.
LDR:01411cam 2200325Mu 45 0 001 664128
003 OCoLC
005 20100813052013.0
006 m d
007 cr mn|---|||||
008 110106s2008 xx o 000 0 eng d
020 $a 9781420065312 (electronic bk.)
020 $a 1420065408 (electronic bk.)
035 $a (OCoLC)476268118
035 $a ocn476268118
040 $a EBLCP $c EBLCP
049 $a FISA
050 1 4 $a TK7870.15.J36 2009 $a TK7870.15
082 0 0 $a 621.381046
100 1 $a Jamnia, Ali. $3 761223
245 1 0 $a Practical Guide to the Packaging of Electronics : $b Thermal and Mechanical Design and Analysis. $h [electronic resource].
250 $a 2nd ed.
260 $a Hoboken : $b Taylor & Francis Ltd, $c 2008.
300 $a 336 p.
490 1 $a Dekker Mechanical Engineering, v. 146
520 $a Presents a basic understanding of the issues that concern the field of electronics packaging. This work discusses topics including various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; and, mechanical, electrical and chemically induced reliability.
533 $a Electronic reproduction. $n Available via World Wide Web.
538 $a Mode of access: World Wide Web.
650 4 $a Electronic packaging. $3 556061
655 7 $a Electronic books. $2 local $3 554714
710 2 $a Ebooks Corporation. $3 683803
776 1 $z 9781420065312
830 0 $a Dekker Mechanical Engineering, v. 146. $3 761224
856 4 0 $3 Publisher description $u http://www.crcnetbase.com/doi/book/10.1201/9781420065404
938 $a EBL - Ebook Library $b EBLB $n EBL427051
994 $a C0 $b FIS

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