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Practical Guide to the Packaging of ...
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Ebooks Corporation.
Practical Guide to the Packaging of Electronics : = Thermal and Mechanical Design and Analysis.
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Practical Guide to the Packaging of Electronics :/
其他題名:
Thermal and Mechanical Design and Analysis.
作者:
Jamnia, Ali.
出版者:
Hoboken :Taylor & Francis Ltd, : 2008.,
面頁冊數:
336 p.
標題:
Electronic packaging. -
電子資源:
http://www.crcnetbase.com/doi/book/10.1201/9781420065404
ISBN:
9781420065312 (electronic bk.)
Practical Guide to the Packaging of Electronics : = Thermal and Mechanical Design and Analysis.
Jamnia, Ali.
Practical Guide to the Packaging of Electronics :
Thermal and Mechanical Design and Analysis.[electronic resource]. - 2nd ed. - Hoboken :Taylor & Francis Ltd,2008. - 336 p. - Dekker Mechanical Engineering, v. 146. - Dekker Mechanical Engineering, v. 146..
Presents a basic understanding of the issues that concern the field of electronics packaging. This work discusses topics including various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; and, mechanical, electrical and chemically induced reliability.
Electronic reproduction.
Available via World Wide Web.
Mode of access: World Wide Web.
ISBN: 9781420065312 (electronic bk.)Subjects--Topical Terms:
556061
Electronic packaging.
Index Terms--Genre/Form:
554714
Electronic books.
LC Class. No.: TK7870.15.J36 2009
Dewey Class. No.: 621.381046
Practical Guide to the Packaging of Electronics : = Thermal and Mechanical Design and Analysis.
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