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Advanced processes for 193-nm immersion lithography

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Advanced processes for 193-nm immersion lithography/ Yayi Wei, Robert L. Brainard.
Author:	Wei, Yayi.
other author:	Brainard, Robert L.
Published:	Bellingham, Wash. (1000 20th St. Bellingham WA 98225-6705 USA) :SPIE, : c2009.,
Description:	1 online resource (xix, 315 p. : ill.) :digital file. :
Notes:	"SPIE digital library."
Subject:	Immersion lithography. -
Online resource:	http://dx.doi.org/10.1117/3.820233
ISBN:	9780819478436 (electronic)

Advanced processes for 193-nm immersion lithography
Wei, Yayi.

Advanced processes for 193-nm immersion lithography[electronic resource] /Yayi Wei, Robert L. Brainard. - Bellingham, Wash. (1000 20th St. Bellingham WA 98225-6705 USA) :SPIE,c2009. - 1 online resource (xix, 315 p. : ill.) :digital file. - SPIE Press monograph ;PM189. - SPIE Press monograph ;PM103..

"SPIE digital library."

Includes bibliographical references and index.

1. Immersion Lithography and Its Challenges -- Basics of Photolithography -- Immersion Lithography and Its Advantages -- Challenges for the 193i Process.

Restricted to subscribers or individual electronic text purchasers.

This book is a comprehensive guide to advanced processes and materials used in 193-nm immersion lithography (193i). It is an important text for those new to the field as well as for current practitioners who want to broaden their understanding of this latest technology. The book can be used as course material for graduate students of electrical engineering, material sciences, physics, chemistry, and microelectronics engineering and can also be used to train engineers involved in the manufacture of integrated circuits. It provides techniques for selecting critical materials (topcoats, photoresists, and antireflective coatings) and optimizing immersion processes to ensure higher performance and lower defectivity at lower cost. This book also includes sections on shrinking, trimming, and smoothing of the resist pattern to reduce feature sizes and line-edge roughness. Finally, it describes the recent development of 193i in combination with double exposure and double patterning.

System requirements: Adobe Acrobat Reader.

ISBN: 9780819478436 (electronic)

Standard No.: 10.1117/3.820233doiSubjects--Topical Terms:

877239
Immersion lithography.

LC Class. No.: TK7872.M3 / W45 2009e

Dewey Class. No.: 621.3815/31

Advanced processes for 193-nm immersion lithography
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035 $a (CaBNVSL)gtp00535525
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050 4 $a TK7872.M3 $b W45 2009e
082 0 4 $a 621.3815/31 $2 22
100 1 $a Wei, Yayi. $3 877237
245 1 0 $a Advanced processes for 193-nm immersion lithography $h [electronic resource] / $c Yayi Wei, Robert L. Brainard.
260 $a Bellingham, Wash. (1000 20th St. Bellingham WA 98225-6705 USA) : $b SPIE, $c c2009.
300 $a 1 online resource (xix, 315 p. : ill.) : $b digital file.
490 1 $a SPIE Press monograph ; $v PM189
500 $a "SPIE digital library."
504 $a Includes bibliographical references and index.
505 0 $a 1. Immersion Lithography and Its Challenges -- Basics of Photolithography -- Immersion Lithography and Its Advantages -- Challenges for the 193i Process.
505 0 $a 2. Process Steps in the Track -- Coating Module -- Baking Module -- Development -- Resist Line Collapse and Corrective Measures -- Blob Defects -- 193-nm Immersion-Specific Track Process.
505 0 $a 3. Resist Leaching and Water Uptake -- Leaching Test Methods -- Leaching Dynamics -- Leaching with 193-nm Exposure -- Pre-Rinse to Partially Remove Leached Contaminants -- Lens Contamination Caused by Resist Leaching -- Water Uptake in Resist Film.
505 0 $a 4. Contact Angle of Water on Resist Stacks -- Definition of Static and Dynamic Contact Angles -- Dynamics of the Water Meniscus -- Experimental Results from the Model Immersion Head -- Leakage Mechanism of the Water Meniscus -- Methods for Measuring Contact Angles -- Process-Induced Contact Angle Variation.
505 0 $a 5. Topcoat and Resist Processes for Immersion Lithography -- Selection of Developer-Soluble Topcoat -- Lithographic Assessment of Developer-Soluble Topcoats with Resists -- Optimization of Developer-Soluble Topcoat Processes -- 193i Resists without Topcoats.
505 0 $a 6. Immersion Defects and Defect-Reduction Strategies -- The Basics of Defect Detection -- Quality of the Immersion Water -- Appearance of Bubble Defects -- Origins of Bubbles -- Defects Caused by Transparent Particles and Blisters -- Watermark Defects -- Strategies for Reducing Watermark Defects -- Particles -- Pinholes in Ultrathin Films of Topcoat or Resist -- Microbridging Defects -- Summary.
505 0 $a 7. Antireflection Coatings and Underlayer Technology -- General Requirements for Conventional Bottom Antireflection Coatings (BARCs) -- Challenges to Antireflection Control for Hyper-NA Exposure -- Spin-on Dual-Layer BARCs and Graded Spin-on BARCs -- Si-Containing BARC and Spin-on Carbon -- Gap-Fill Materials -- Top Antireflection Coatings (TARCs) -- Developer-Soluble BARCs (DBARCs).
505 0 $a 8. Resist Shrink and Trim Processes -- Resist Thermal Reflow -- Chemical Shrink -- Shrink Assist Film for Enhanced Resolution (SAFIER) -- Shrinking via Fluorination Process -- Shrinking via Silylation Process -- Plasma-Assisted Shrink -- Evaluation of Shrink Processes -- Trim Processes.
505 0 $a 9. Double Exposure and Double Patterning -- Introduction -- Double Exposure with One Resist Layer -- Double Exposure with Two Full Lithographic Processes -- Double Patterning -- Novel Approaches -- Additional Comments.
505 0 $a 10. Line-Edge Roughness of Resist Patterns -- Metrology of Line-Edge Roughness (LER) and Line-Width Roughness (LWR) -- Formation of LER -- Strategies for Reducing Resist LER -- Transferring LER from Resist to Substrate: the Effect of Etch.
505 0 $a 11. Extendibility of 193-nm Immersion Lithography -- Fluids with High Refractive Indices -- Materials with High Refractive Indices -- Resists with High Refractive Indices -- Solid Immersion -- Other 193i+ Topics.
506 $a Restricted to subscribers or individual electronic text purchasers.
520 $a This book is a comprehensive guide to advanced processes and materials used in 193-nm immersion lithography (193i). It is an important text for those new to the field as well as for current practitioners who want to broaden their understanding of this latest technology. The book can be used as course material for graduate students of electrical engineering, material sciences, physics, chemistry, and microelectronics engineering and can also be used to train engineers involved in the manufacture of integrated circuits. It provides techniques for selecting critical materials (topcoats, photoresists, and antireflective coatings) and optimizing immersion processes to ensure higher performance and lower defectivity at lower cost. This book also includes sections on shrinking, trimming, and smoothing of the resist pattern to reduce feature sizes and line-edge roughness. Finally, it describes the recent development of 193i in combination with double exposure and double patterning.
530 $a Also available in print version.
538 $a System requirements: Adobe Acrobat Reader.
538 $a Mode of access: World Wide Web.
650 0 $a Immersion lithography. $3 877239
650 0 $a Semiconductors $x Etching. $3 877240
650 0 $a Integrated circuits $x Design and construction. $3 561265
700 1 $a Brainard, Robert L. $3 877238
710 2 $a Society of Photo-optical Instrumentation Engineers. $3 700253
830 0 $a SPIE Press monograph ; $v PM103. $3 877204
856 4 0 $u http://dx.doi.org/10.1117/3.820233