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Electrical modeling and design for 3...
~
Li, Er-Ping.
Electrical modeling and design for 3D system integration = 3D integrated circuits and packaging, signal integrity, power integrity and EMC /
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Electrical modeling and design for 3D system integration/ Er-Ping Li.
其他題名:
3D integrated circuits and packaging, signal integrity, power integrity and EMC /
作者:
Li, Er-Ping.
出版者:
[United States] :IEEE Press ; : c2012.,
面頁冊數:
1 online resource.
附註:
Includes index.
標題:
Three-dimensional integrated circuits. -
電子資源:
http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
ISBN:
9781118166727 (electronic bk.)
Electrical modeling and design for 3D system integration = 3D integrated circuits and packaging, signal integrity, power integrity and EMC /
Li, Er-Ping.
Electrical modeling and design for 3D system integration
3D integrated circuits and packaging, signal integrity, power integrity and EMC /[electronic resource] :Er-Ping Li. - [United States] :IEEE Press ;c2012. - 1 online resource.
Includes index.
Includes bibliographical references and index.
Macromodeling of Complex Interconnects in 3D Integration --
ISBN: 9781118166727 (electronic bk.)
Standard No.: 9786613650047
Source: 10.1002/9781118166727Wiley InterSciencehttp://www3.interscience.wiley.comSubjects--Topical Terms:
880880
Three-dimensional integrated circuits.
Index Terms--Genre/Form:
554714
Electronic books.
LC Class. No.: TK7874.893 / .E7 2012
Dewey Class. No.: 621.3815
Electrical modeling and design for 3D system integration = 3D integrated circuits and packaging, signal integrity, power integrity and EMC /
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