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Lead free solder = mechanics and rel...
~
Pang, John Hock Lye.
Lead free solder = mechanics and reliability /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Lead free solder/ by John Hock Lye Pang.
Reminder of title:
mechanics and reliability /
Author:
Pang, John Hock Lye.
Published:
New York, NY :Springer Science+Business Media, LLC, : 2012.,
Description:
x, 175 p. :ill., digital ; : 24 cm.;
Contained By:
Springer eBooks
Subject:
Solder and soldering. -
Online resource:
http://dx.doi.org/10.1007/978-1-4614-0463-7
ISBN:
9781461404637 (electronic bk.)
Lead free solder = mechanics and reliability /
Pang, John Hock Lye.
Lead free solder
mechanics and reliability /[electronic resource] :by John Hock Lye Pang. - New York, NY :Springer Science+Business Media, LLC,2012. - x, 175 p. :ill., digital ;24 cm.
ISBN: 9781461404637 (electronic bk.)Subjects--Topical Terms:
556062
Solder and soldering.
LC Class. No.: TS610 / .P36 2012
Dewey Class. No.: 671.52
Lead free solder = mechanics and reliability /
LDR
:00782nam a2200253 a 4500
001
739212
003
Springer
005
20120302165851.0
006
m d
007
cr nn 008maaau
008
130715s2012 nyu s 0 eng d
020
$a
9781461404637 (electronic bk.)
020
$a
9781461404620 (paper)
035
$a
978-1-4614-0462-0
040
$a
GP
$c
GP
041
0
$a
eng
050
4
$a
TS610
$b
.P36 2012
082
0 4
$a
671.52
$2
23
090
$a
TS610
$b
.P191 2012
100
1
$a
Pang, John Hock Lye.
$3
888222
245
1 0
$a
Lead free solder
$h
[electronic resource] :
$b
mechanics and reliability /
$c
by John Hock Lye Pang.
260
$a
New York, NY :
$b
Springer Science+Business Media, LLC,
$c
2012.
300
$a
x, 175 p. :
$b
ill., digital ;
$c
24 cm.
650
0
$a
Solder and soldering.
$3
556062
650
0
$a
Lead-free electronics manufacturing processes.
$3
771835
650
0
$a
Green electronics.
$3
632800
650
1 4
$a
Engineering.
$3
561152
650
2 4
$a
Electronics and Microelectronics, Instrumentation.
$3
670219
650
2 4
$a
Optical and Electronic Materials.
$3
593919
650
2 4
$a
Continuum Mechanics and Mechanics of Materials.
$3
670886
650
2 4
$a
Circuits and Systems.
$3
670901
710
2
$a
SpringerLink (Online service)
$3
593884
773
0
$t
Springer eBooks
856
4 0
$u
http://dx.doi.org/10.1007/978-1-4614-0463-7
950
$a
Engineering (Springer-11647)
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