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Encyclopedia of thermal packaging.. ...

Bao Yang, Peng Wang

Encyclopedia of thermal packaging.. Set 1,. Thermal packaging techniques /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Encyclopedia of thermal packaging./ editor-in-chief Avram Bar-Cohen.
remainder title:	Thermal packaging techniques
other author:	Gary L. Solbrekken.
Published:	Singapore ;World Scientific, : c2013.,
Description:	6 v. :ill. ; : 26 cm.;
Subject:	Electronic packaging. -
ISBN:	9789814313780 (set : cloth) :

Encyclopedia of thermal packaging.. Set 1,. Thermal packaging techniques /
Encyclopedia of thermal packaging.Set 1,Thermal packaging techniques /Thermal packaging techniqueseditor-in-chief Avram Bar-Cohen. - Singapore ;World Scientific,c2013. - 6 v. :ill. ;26 cm.

Includes bibliographical references and indexes.

Microchannel heat sinks for electronics cooling /Suresh V. Garimella, Tannaz Harirchian --Vol. 1.

ISBN: 9789814313780 (set : cloth) :NT41400

Nat. Bib. No.: GBB204557bnbSubjects--Topical Terms:

556061
Electronic packaging.

LC Class. No.: TK7870.15 / E53 2013

Dewey Class. No.: 621.381046

Encyclopedia of thermal packaging.. Set 1,. Thermal packaging techniques /
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020 $a 9789814327626 (v. 6 : cloth)
020 $a 981432762X (v. 6 : cloth)
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245 0 0 $a Encyclopedia of thermal packaging. $n Set 1, $p Thermal packaging techniques / $c editor-in-chief Avram Bar-Cohen.
246 3 0 $a Thermal packaging techniques
260 # $a Singapore ; $a London : $c c2013. $b World Scientific,
300 $a 6 v. : $b ill. ; $c 26 cm.
504 $a Includes bibliographical references and indexes.
505 0 # $g Vol. 1. $t Microchannel heat sinks for electronics cooling / $r Suresh V. Garimella, Tannaz Harirchian -- $g v. 2. $t Air- and liquid-cooled cold plates / $r Allan Kraus -- $g v. 3. $t Dielectric liquid cooling of immersed components / $r Karl J.L. Geisler, Avram Bar-Cohen -- $g v. 4. $t Thermoelectric microcoolers / $r Bao Yang, Peng Wang -- $g v. 5. $t Energy efficienct solid state lighting / $r Mehmet Arik ... [et al.] -- $g v. 6. $t Experimental thermofluid characterization of electronic components / $r Gary L. Solbrekken.
650 # 0 $a Electronic packaging. $3 556061
650 # 0 $a Insulation (Heat) $3 915223
700 1 2 $a Gary L. Solbrekken. $t Experimental thermofluid characterization of electronic components $3 925726
700 1 2 $a Mehmet Arik. $t Energy efficienct solid state lighting $3 925725
700 1 2 $a Bao Yang, Peng Wang $t Thermoelectric microcoolers $3 925724
700 1 2 $a Karl J.L. Geisler, Avram Bar-Cohen $t Dielectric liquid cooling of immersed components $3 925723
700 1 2 $a Allan Kraus $t Air- and liquid-cooled cold plates $3 925722
700 1 2 $a Suresh V. Garimella, Tannaz Harirchian $t Microchannel heat sinks for electronics cooling $3 925721
700 1 # $a Bar-Cohen, Avram, $d 1946- $3 915222