國立虎尾科技大學 |

登入

回首頁

3D IC stacking technology /

Kumar, Ajay.

3D IC stacking technology /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	3D IC stacking technology // Banqiu Wu, Ajay Kumar, Sesh Ramaswami, editors.
其他題名:	Three D IC stacking technology.
其他作者:	Wu, Banqiu.
出版者:	New York :McGraw-Hill Professional, : 2011.,
面頁冊數:	xviii, 521 p. :ill. (chiefly col.) ; : 24 cm.;
標題:	Three-dimensional integrated circuits. -
ISBN:	9780071741958 (hbk.) :

3D IC stacking technology /
3D IC stacking technology /Three D IC stacking technology.Banqiu Wu, Ajay Kumar, Sesh Ramaswami, editors. - 1st ed. - New York :McGraw-Hill Professional,2011. - xviii, 521 p. :ill. (chiefly col.) ;24 cm.

Includes bibliographical references and index.

"The latest advances in three-dimensional integrated circuit stacking technology 3D IC Stacking Technology is a comprehensive resource on three-dimensional stacking technology, including scientific theory, processing methods, applications, and an overview of the industry's technological future. The book is targeted to semiconductor engineers and portable device designers. The quality and functional capabilities of nearly all of today's electronic devices and the production lines that produce them are dependent on key internal semiconductor components--ICs. Lithography and packaging integration are the determining factors in keeping pace with the electronics industry's quest to have more and more transistors on chip product by shrinking ICs and other related products, or by stacking the multiple chips into one chip device. This in-depth volume covers these cutting-edge technologies. 3D IC Stacking Technology Focuses on industrial applications Includes detailed fabrication processes Covers a separate fabrication step in each chapter, written by an industry expert Provides a one-stop knowledge resource for 3D IC technology Discusses future applications and device design potentials Comprehensive coverage: Design challenges; Process sequence integration; TSV etch; Chemical vapor; Barrier/ seed deposition; ECD fill; Chemical mechanical polishing; Wafer thinning; Temporary and permanent bonding; Cost of ownership"--

ISBN: 9780071741958 (hbk.) :NT3720

LCCN: 2011016598Subjects--Topical Terms:

880880
Three-dimensional integrated circuits.

LC Class. No.: TK7874.893 / .A14 2011

Dewey Class. No.: 621.3815/3

3D IC stacking technology /
LDR:02430cam a2200205 a 4500 001 759355
008 131016s2011 nyua b 001 0 eng
010 $a 2011016598
020 $a 9780071741958 (hbk.) : $c NT3720
035 $a 16751543
040 $a DLC $c DLC $d DLC $c NFU
050 0 0 $a TK7874.893 $b .A14 2011
082 0 0 $a 621.3815/3 $2 23
245 0 0 $a 3D IC stacking technology / $c Banqiu Wu, Ajay Kumar, Sesh Ramaswami, editors.
246 3 # $a Three D IC stacking technology.
250 $a 1st ed.
260 # $a New York : $c 2011. $b McGraw-Hill Professional,
300 $a xviii, 521 p. : $b ill. (chiefly col.) ; $c 24 cm.
504 $a Includes bibliographical references and index.
520 # $a "The latest advances in three-dimensional integrated circuit stacking technology 3D IC Stacking Technology is a comprehensive resource on three-dimensional stacking technology, including scientific theory, processing methods, applications, and an overview of the industry's technological future. The book is targeted to semiconductor engineers and portable device designers. The quality and functional capabilities of nearly all of today's electronic devices and the production lines that produce them are dependent on key internal semiconductor components--ICs. Lithography and packaging integration are the determining factors in keeping pace with the electronics industry's quest to have more and more transistors on chip product by shrinking ICs and other related products, or by stacking the multiple chips into one chip device. This in-depth volume covers these cutting-edge technologies. 3D IC Stacking Technology Focuses on industrial applications Includes detailed fabrication processes Covers a separate fabrication step in each chapter, written by an industry expert Provides a one-stop knowledge resource for 3D IC technology Discusses future applications and device design potentials Comprehensive coverage: Design challenges; Process sequence integration; TSV etch; Chemical vapor; Barrier/ seed deposition; ECD fill; Chemical mechanical polishing; Wafer thinning; Temporary and permanent bonding; Cost of ownership"-- $c Provided by publisher.
520 # $a "This pioneering work explores three-dimensional integrated circuit stacking technology which allows for more transistors on a chip and benefits portable electronics device design with smaller-scale IC, lower power consumption, less heat generation, extended battery life, and lower costs of operation"-- $c Provided by publisher.
650 # 0 $a Three-dimensional integrated circuits. $3 880880
650 # 0 $a Microelectronic packaging. $3 598419
700 1 # $a Wu, Banqiu. $3 795567
700 1 # $a Kumar, Ajay. $3 925704
700 1 # $a Ramaswami, Sesh. $3 925705