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應用鋁鍺錫暫態液相鍵結技術於晶片接合面之研究 = = Study of...

張奕鉦

應用鋁鍺錫暫態液相鍵結技術於晶片接合面之研究 = = Study of The Die-Attached Joint by Using AlGeSn TLP Bonded Technology /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	應用鋁鍺錫暫態液相鍵結技術於晶片接合面之研究 = / 張奕鉦撰.
Reminder of title:	Study of The Die-Attached Joint by Using AlGeSn TLP Bonded Technology /
remainder title:	Study of The Die-Attached Joint by Using AlGeSn TLP Bonded Technology.
Author:	張奕鉦
Published:	雲林縣 :國立虎尾科技大學 , : 民103.07.,
Description:	9, 61 面 :圖, 表 ; : 30公分.;
Notes:	指導教授：陳文瑞.
Subject:	thermal evaporation. -
Online resource:	http://cetd.lib.nfu.edu.tw/etdservice/view_metadata?etdun=U0028-2108201415430300

應用鋁鍺錫暫態液相鍵結技術於晶片接合面之研究 = = Study of The Die-Attached Joint by Using AlGeSn TLP Bonded Technology /
張奕鉦

應用鋁鍺錫暫態液相鍵結技術於晶片接合面之研究 = Study of The Die-Attached Joint by Using AlGeSn TLP Bonded Technology /Study of The Die-Attached Joint by Using AlGeSn TLP Bonded Technology.張奕鉦撰. - 初版. - 雲林縣 :國立虎尾科技大學 ,民103.07. - 9, 61 面 :圖, 表 ;30公分.

指導教授：陳文瑞.

含參考書目.Subjects--Topical Terms:

997652
thermal evaporation.

應用鋁鍺錫暫態液相鍵結技術於晶片接合面之研究 = = Study of The Die-Attached Joint by Using AlGeSn TLP Bonded Technology /
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