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Design-for-test and test optimizatio...
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Design-for-test and test optimization techniques for TSV-based 3D stacked ICs
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Design-for-test and test optimization techniques for TSV-based 3D stacked ICs/ by Brandon Noia, Krishnendu Chakrabarty.
作者:
Noia, Brandon.
其他作者:
Chakrabarty, Krishnendu.
出版者:
Cham :Springer International Publishing : : 2014.,
面頁冊數:
xviii, 247 p. :ill. (some col.), digital ; : 24 cm.;
Contained By:
Springer eBooks
標題:
Three-dimensional integrated circuits - Testing. -
電子資源:
http://dx.doi.org/10.1007/978-3-319-02378-6
ISBN:
9783319023786 (electronic bk.)
Design-for-test and test optimization techniques for TSV-based 3D stacked ICs
Noia, Brandon.
Design-for-test and test optimization techniques for TSV-based 3D stacked ICs
[electronic resource] /by Brandon Noia, Krishnendu Chakrabarty. - Cham :Springer International Publishing :2014. - xviii, 247 p. :ill. (some col.), digital ;24 cm.
ISBN: 9783319023786 (electronic bk.)Subjects--Topical Terms:
1022162
Three-dimensional integrated circuits
--Testing.
Dewey Class. No.: 621.3815
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