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Reflow soldering processes = SMT, BG...
~
Lee, Ning-Cheng.
Reflow soldering processes = SMT, BGA, CSP and flip chip technologies /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Reflow soldering processes/ Ning-Cheng Lee.
Reminder of title:
SMT, BGA, CSP and flip chip technologies /
Author:
Lee, Ning-Cheng.
Published:
Boston :Newnes, : c2002.,
Description:
ix, 270 p. :ill. ; : 26 cm.;
Subject:
Solder and soldering. -
Online resource:
click for full text (2015 TAEBDC PDA eBooks Trial, Trial Period: 2015.6.3-2015.12.31)
ISBN:
9780750672184 (electronic bk.)
Reflow soldering processes = SMT, BGA, CSP and flip chip technologies /
Lee, Ning-Cheng.
Reflow soldering processes
SMT, BGA, CSP and flip chip technologies /[electronic resource] :Ning-Cheng Lee. - Boston :Newnes,c2002. - ix, 270 p. :ill. ;26 cm.
Includes bibliographical references and index.
ISBN: 9780750672184 (electronic bk.)
LCCN: 2001031713Subjects--Topical Terms:
556062
Solder and soldering.
LC Class. No.: TK7836 / .L43 2002
Dewey Class. No.: 621.381/046
Reflow soldering processes = SMT, BGA, CSP and flip chip technologies /
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click for full text (2015 TAEBDC PDA eBooks Trial, Trial Period: 2015.6.3-2015.12.31)
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