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Reflow soldering processes = SMT, BG...
~
Lee, Ning-Cheng.
Reflow soldering processes = SMT, BGA, CSP and flip chip technologies /
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Reflow soldering processes/ Ning-Cheng Lee.
其他題名:
SMT, BGA, CSP and flip chip technologies /
作者:
Lee, Ning-Cheng.
出版者:
Boston :Newnes, : c2002.,
面頁冊數:
ix, 270 p. :ill. ; : 26 cm.;
標題:
Solder and soldering. -
電子資源:
click for full text (2015 TAEBDC PDA eBooks Trial, Trial Period: 2015.6.3-2015.12.31)
ISBN:
9780750672184 (electronic bk.)
Reflow soldering processes = SMT, BGA, CSP and flip chip technologies /
Lee, Ning-Cheng.
Reflow soldering processes
SMT, BGA, CSP and flip chip technologies /[electronic resource] :Ning-Cheng Lee. - Boston :Newnes,c2002. - ix, 270 p. :ill. ;26 cm.
Includes bibliographical references and index.
ISBN: 9780750672184 (electronic bk.)
LCCN: 2001031713Subjects--Topical Terms:
556062
Solder and soldering.
LC Class. No.: TK7836 / .L43 2002
Dewey Class. No.: 621.381/046
Reflow soldering processes = SMT, BGA, CSP and flip chip technologies /
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