語系:
繁體中文
English
說明(常見問題)
登入
回首頁
切換:
標籤
|
MARC模式
|
ISBD
Three-dimensional molded interconnec...
~
Franke, Jorg.
Three-dimensional molded interconnect devices (3D-MID) = materials, Manufacturing, assembly, and applications forinjection molded circuit carriers /
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Three-dimensional molded interconnect devices (3D-MID)/ Jorg Franke.
其他題名:
materials, Manufacturing, assembly, and applications forinjection molded circuit carriers /
作者:
Franke, Jorg.
出版者:
Munich ;Hanser, : 2014.,
面頁冊數:
xii, 356 p. :col. ill. ; : 25 cm.;
標題:
Interconnects (Integrated circuit technology) - Design and construction. -
電子資源:
click for full text (2015 TAEBDC PDA eBooks Trial, Trial Period: 2015.6.3-2015.12.31)
ISBN:
9781569905517 (electronic bk.)
Three-dimensional molded interconnect devices (3D-MID) = materials, Manufacturing, assembly, and applications forinjection molded circuit carriers /
Franke, Jorg.
Three-dimensional molded interconnect devices (3D-MID)
materials, Manufacturing, assembly, and applications forinjection molded circuit carriers /[electronic resource] :Jorg Franke. - Munich ;Hanser,2014. - xii, 356 p. :col. ill. ;25 cm.
Includes bibliographical references and index.
ISBN: 9781569905517 (electronic bk.)Subjects--Topical Terms:
563356
Interconnects (Integrated circuit technology)
--Design and construction.
LC Class. No.: TK7874.53 / .F7713 2014
Dewey Class. No.: 621.3815
Three-dimensional molded interconnect devices (3D-MID) = materials, Manufacturing, assembly, and applications forinjection molded circuit carriers /
LDR
:00963nam a2200205 a 4500
001
811514
005
20150630141839.0
008
150720s2014 ohua sb 001 0 eng
020
$a
9781569905517 (electronic bk.)
020
$a
9781569905517
035
$a
15000973
040
$a
DLC
$b
eng
$c
DLC
$d
YDX
$d
YDXCP
$d
BTCTA
$d
IPL
$d
OCLCO
041
1
$a
eng
$h
ger
050
0 0
$a
TK7874.53
$b
.F7713 2014
082
0 0
$a
621.3815
$2
23
100
1
$a
Franke, Jorg.
$3
1029014
240
1 0
$a
Raumliche elektronische Baugruppen (3D-MID).
$l
English
245
1 0
$a
Three-dimensional molded interconnect devices (3D-MID)
$h
[electronic resource] :
$b
materials, Manufacturing, assembly, and applications forinjection molded circuit carriers /
$c
Jorg Franke.
260
$a
Munich ;
$a
Cincinnati, OH :
$b
Hanser,
$c
2014.
300
$a
xii, 356 p. :
$b
col. ill. ;
$c
25 cm.
504
$a
Includes bibliographical references and index.
650
0
$a
Interconnects (Integrated circuit technology)
$x
Design and construction.
$3
563356
650
0
$a
Injection molding of plastics.
$3
719730
856
4 0
$u
http://www.sciencedirect.com/science/book/9781569905517
$z
click for full text (2015 TAEBDC PDA eBooks Trial, Trial Period: 2015.6.3-2015.12.31)
筆 0 讀者評論
多媒體
評論
新增評論
分享你的心得
Export
取書館別
處理中
...
變更密碼[密碼必須為2種組合(英文和數字)及長度為10碼以上]
登入