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Electroless copper and nickel-phosphorus plating = processing, characterisation and modelling /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Electroless copper and nickel-phosphorus plating/ W. Sha, X. Wu, K.G. Keong.
其他題名:	processing, characterisation and modelling /
作者:	Sha, Wei.
其他作者:	Wu, X.
出版者:	Sawston, Cambridge, UK ;Woodhead Pub., : 2011.,
面頁冊數:	xviii, 285 p. :ill. ; : 25 cm.;
標題:	Electroless plating. -
電子資源:	click for full text (2015 TAEBDC PDA eBooks Trial, Trial Period: 2015.6.3-2015.12.31)
ISBN:	9781845698089 (electronic bk.)

Electroless copper and nickel-phosphorus plating = processing, characterisation and modelling /
Sha, Wei.

Electroless copper and nickel-phosphorus platingprocessing, characterisation and modelling /[electronic resource] :W. Sha, X. Wu, K.G. Keong. - 1st ed. - Sawston, Cambridge, UK ;Woodhead Pub.,2011. - xviii, 285 p. :ill. ;25 cm. - Woodhead Publishing in materials. - Woodhead Publishing in materials..

Includes bibliographical references and index.

This book discusses electroless plating, reviewing the key properties of electroless copper and nickel-phosphorus deposits as well as their practical applications. Part one focuses on electroless copper depositions, including surface morphology and residual stress, modelling surface structure, adhesion strength, electrical resistivity and applications of electroless copper deposits. Part two covers electroless nickel-phosphorus depositions, including modelling the thermodynamics and kinetics of crystallisation, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution and applications of electroless nickel-phosphorus plating. The book is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries. --

ISBN: 9781845698089 (electronic bk.)Subjects--Topical Terms:

1004709
Electroless plating.

LC Class. No.: TS662 / .S53 2011

Dewey Class. No.: 671.7/3

Electroless copper and nickel-phosphorus plating = processing, characterisation and modelling /
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041 0 $a eng
050 1 4 $a TS662 $b .S53 2011
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100 1 $a Sha, Wei. $3 1029346
245 1 0 $a Electroless copper and nickel-phosphorus plating $h [electronic resource] : $b processing, characterisation and modelling / $c W. Sha, X. Wu, K.G. Keong.
250 $a 1st ed.
260 $a Sawston, Cambridge, UK ; $a Philadelphia : $b Woodhead Pub., $c 2011.
300 $a xviii, 285 p. : $b ill. ; $c 25 cm.
490 1 $a Woodhead Publishing in materials
504 $a Includes bibliographical references and index.
520 $a This book discusses electroless plating, reviewing the key properties of electroless copper and nickel-phosphorus deposits as well as their practical applications. Part one focuses on electroless copper depositions, including surface morphology and residual stress, modelling surface structure, adhesion strength, electrical resistivity and applications of electroless copper deposits. Part two covers electroless nickel-phosphorus depositions, including modelling the thermodynamics and kinetics of crystallisation, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution and applications of electroless nickel-phosphorus plating. The book is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries. -- $c Edited summary from book.
650 0 $a Electroless plating. $3 1004709
650 0 $a Copper plating. $3 1021933
650 0 $a Nickel-plating. $3 1029657
650 0 $a Phosphorus. $3 674457
700 1 $a Wu, X. $q (Xiaomin) $3 1029655
700 1 $a Keong, K. G. $q (Kim Ghee) $3 1029656
830 0 $a Woodhead Publishing in materials. $3 561726
856 4 0 $u http://www.sciencedirect.com/science/book/9781845698089 $z click for full text (2015 TAEBDC PDA eBooks Trial, Trial Period: 2015.6.3-2015.12.31)