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Electromigration in thin films and electronic devices = materials and reliability /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Electromigration in thin films and electronic devices/ edited by Choong-Un Kim.
Reminder of title:	materials and reliability /
other author:	Kim, Choong-Un.
Published:	Oxford ;Woodhead Publishing, : c2011.,
Description:	xiii, 340 p. :ill. ; : 25 cm.;
Subject:	Integrated circuits - Deterioration. -
Online resource:	click for full text (2015 TAEBDC PDA eBooks Trial, Trial Period: 2015.6.3-2015.12.31)
ISBN:	9781845699376 (electronic bk.)

Electromigration in thin films and electronic devices = materials and reliability /
Electromigration in thin films and electronic devicesmaterials and reliability /[electronic resource] :edited by Choong-Un Kim. - 1st ed. - Oxford ;Woodhead Publishing,c2011. - xiii, 340 p. :ill. ;25 cm. - Woodhead Publishing in materials. - Woodhead Publishing in materials..

Includes bibliographical references and index.

Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H.Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects/ E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht.

ISBN: 9781845699376 (electronic bk.)Subjects--Topical Terms:

1029673
Integrated circuits
--Deterioration.

LC Class. No.: TK7874 / .E478 2011

Dewey Class. No.: 621.38152

Electromigration in thin films and electronic devices = materials and reliability /
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245 0 0 $a Electromigration in thin films and electronic devices $h [electronic resource] : $b materials and reliability / $c edited by Choong-Un Kim.
250 $a 1st ed.
260 $a Oxford ; $a Philadelphia : $b Woodhead Publishing, $c c2011.
300 $a xiii, 340 p. : $b ill. ; $c 25 cm.
490 1 $a Woodhead Publishing in materials
504 $a Includes bibliographical references and index.
505 0 $a Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H.Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects/ E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht.
650 0 $a Integrated circuits $x Deterioration. $3 1029673
650 0 $a Electrodiffusion. $3 527935
650 0 $a Thin films. $3 560219
650 0 $a Interconnects (Integrated circuit technology) $3 655374
700 1 $a Kim, Choong-Un. $3 1029672
830 0 $a Woodhead Publishing in materials. $3 561726
856 4 0 $u http://www.sciencedirect.com/science/book/9781845699376 $z click for full text (2015 TAEBDC PDA eBooks Trial, Trial Period: 2015.6.3-2015.12.31)