語系:
繁體中文
English
說明(常見問題)
登入
回首頁
切換:
標籤
|
MARC模式
|
ISBD
Fundamentals of lead-free solder int...
~
SpringerLink (Online service)
Fundamentals of lead-free solder interconnect technology = from microstructures to reliability /
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Fundamentals of lead-free solder interconnect technology/ by Tae-Kyu Lee ... [et al.].
其他題名:
from microstructures to reliability /
其他作者:
Lee, Tae-Kyu.
出版者:
Boston, MA :Springer US : : 2015.,
面頁冊數:
xiii, 253 p. :ill., digital ; : 24 cm.;
Contained By:
Springer eBooks
標題:
Lead-free electronics manufacturing processes. -
電子資源:
http://dx.doi.org/10.1007/978-1-4614-9266-5
ISBN:
9781461492665 (electronic bk.)
Fundamentals of lead-free solder interconnect technology = from microstructures to reliability /
Fundamentals of lead-free solder interconnect technology
from microstructures to reliability /[electronic resource] :by Tae-Kyu Lee ... [et al.]. - Boston, MA :Springer US :2015. - xiii, 253 p. :ill., digital ;24 cm.
Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again.
This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering
ISBN: 9781461492665 (electronic bk.)
Standard No.: 10.1007/978-1-4614-9266-5doiSubjects--Topical Terms:
771835
Lead-free electronics manufacturing processes.
LC Class. No.: TK7836
Dewey Class. No.: 621.381
Fundamentals of lead-free solder interconnect technology = from microstructures to reliability /
LDR
:02544nam a2200325 a 4500
001
835082
003
DE-He213
005
20150714092400.0
006
m d
007
cr nn 008maaau
008
160421s2015 mau s 0 eng d
020
$a
9781461492665 (electronic bk.)
020
$a
9781461492658 (paper)
024
7
$a
10.1007/978-1-4614-9266-5
$2
doi
035
$a
978-1-4614-9266-5
040
$a
GP
$c
GP
041
0
$a
eng
050
4
$a
TK7836
072
7
$a
TJF
$2
bicssc
072
7
$a
TEC008000
$2
bisacsh
072
7
$a
TEC008070
$2
bisacsh
082
0 4
$a
621.381
$2
23
090
$a
TK7836
$b
.F981 2015
245
0 0
$a
Fundamentals of lead-free solder interconnect technology
$h
[electronic resource] :
$b
from microstructures to reliability /
$c
by Tae-Kyu Lee ... [et al.].
260
$a
Boston, MA :
$c
2015.
$b
Springer US :
$b
Imprint: Springer,
300
$a
xiii, 253 p. :
$b
ill., digital ;
$c
24 cm.
505
0
$a
Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again.
520
$a
This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering
650
0
$a
Lead-free electronics manufacturing processes.
$3
771835
650
0
$a
Solder and soldering.
$3
556062
650
1 4
$a
Engineering.
$3
561152
650
2 4
$a
Electronics and Microelectronics, Instrumentation.
$3
670219
650
2 4
$a
Optical and Electronic Materials.
$3
593919
650
2 4
$a
Circuits and Systems.
$3
670901
700
1
$a
Lee, Tae-Kyu.
$3
1064103
710
2
$a
SpringerLink (Online service)
$3
593884
773
0
$t
Springer eBooks
856
4 0
$u
http://dx.doi.org/10.1007/978-1-4614-9266-5
950
$a
Engineering (Springer-11647)
筆 0 讀者評論
多媒體
評論
新增評論
分享你的心得
Export
取書館別
處理中
...
變更密碼[密碼必須為2種組合(英文和數字)及長度為10碼以上]
登入