國立虎尾科技大學 |

Fundamentals of lead-free solder interconnect technology = from microstructures to reliability /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Fundamentals of lead-free solder interconnect technology/ by Tae-Kyu Lee ... [et al.].
Reminder of title:	from microstructures to reliability /
other author:	Lee, Tae-Kyu.
Published:	Boston, MA :Springer US : : 2015.,
Description:	xiii, 253 p. :ill., digital ; : 24 cm.;
Contained By:	Springer eBooks
Subject:	Lead-free electronics manufacturing processes. -
Online resource:	http://dx.doi.org/10.1007/978-1-4614-9266-5
ISBN:	9781461492665 (electronic bk.)

Fundamentals of lead-free solder interconnect technology = from microstructures to reliability /
Fundamentals of lead-free solder interconnect technologyfrom microstructures to reliability /[electronic resource] :by Tae-Kyu Lee ... [et al.]. - Boston, MA :Springer US :2015. - xiii, 253 p. :ill., digital ;24 cm.

Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again.

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering

ISBN: 9781461492665 (electronic bk.)

Standard No.: 10.1007/978-1-4614-9266-5doiSubjects--Topical Terms:

771835
Lead-free electronics manufacturing processes.

LC Class. No.: TK7836

Dewey Class. No.: 621.381

Fundamentals of lead-free solder interconnect technology = from microstructures to reliability /
LDR:02544nam a2200325 a 4500 001 835082
003 DE-He213
005 20150714092400.0
006 m d
007 cr nn 008maaau
008 160421s2015 mau s 0 eng d
020 $a 9781461492665 (electronic bk.)
020 $a 9781461492658 (paper)
024 7 $a 10.1007/978-1-4614-9266-5 $2 doi
035 $a 978-1-4614-9266-5
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7836
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TEC008070 $2 bisacsh
082 0 4 $a 621.381 $2 23
090 $a TK7836 $b .F981 2015
245 0 0 $a Fundamentals of lead-free solder interconnect technology $h [electronic resource] : $b from microstructures to reliability / $c by Tae-Kyu Lee ... [et al.].
260 $a Boston, MA : $c 2015. $b Springer US : $b Imprint: Springer,
300 $a xiii, 253 p. : $b ill., digital ; $c 24 cm.
505 0 $a Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again.
520 $a This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering
650 0 $a Lead-free electronics manufacturing processes. $3 771835
650 0 $a Solder and soldering. $3 556062
650 1 4 $a Engineering. $3 561152
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 670219
650 2 4 $a Optical and Electronic Materials. $3 593919
650 2 4 $a Circuits and Systems. $3 670901
700 1 $a Lee, Tae-Kyu. $3 1064103
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-1-4614-9266-5
950 $a Engineering (Springer-11647)