Language:
English
繁體中文
Help
Login
Back
Switch To:
Labeled
|
MARC Mode
|
ISBD
Molecular modeling and multiscaling ...
~
SpringerLink (Online service)
Molecular modeling and multiscaling issues for electronic material applications.. Volume 2
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Molecular modeling and multiscaling issues for electronic material applications./ edited by Artur Wymyslowski ... [et al.].
other author:
Wymyslowski, Artur.
Published:
Cham :Springer International Publishing : : 2015.,
Description:
x, 194 p. :ill., digital ; : 24 cm.;
Contained By:
Springer eBooks
Subject:
Molecules - Models. -
Online resource:
http://dx.doi.org/10.1007/978-3-319-12862-7
ISBN:
9783319128627 (electronic bk.)
Molecular modeling and multiscaling issues for electronic material applications.. Volume 2
Molecular modeling and multiscaling issues for electronic material applications.
Volume 2[electronic resource] /edited by Artur Wymyslowski ... [et al.]. - Cham :Springer International Publishing :2015. - x, 194 p. :ill., digital ;24 cm.
Molecular Modeling of pH-Dependent Properties of Emeraldine Base Polyaniline for pH-Based Chemical Sensors -- Two Approaches of Study Cu/Epoxy Interface Enhancement with Benzenethiol Promoter -- Molecular Dynamics Simulation of Pore Formation Mechanism for Deposition of Poly (vinylidene fluoride-co-trifluoroethylene) on Gold Substrate -- Investigating the Influence of Moisture by Molecular Dynamics Simulations -- Analysis of the Adhesion Work with a Molecular Modeling Method and a Wetting Angle Measurement -- Using Coarse-Grained Molecular Models (Molecular-Mesocale) of a Copper Oxide-Epoxy Interface to Obtain Stress-Strain Failure Predictions which Include Interfacial Roughness, Water and Filler Effects -- Establishment of the Mesoscale Parameters for Separation: A Non-Equilibrium Molecular Dynamics Model -- Mechanics of Graphene and Carbon Nanotubes under Uniaxial Compression and Tension -- Analysis of an Influence of a Conversion Level on Simulation Results of the Crosslinked Polymers.
This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction. This book also: Discusses multiscale modeling of materials at the mesoscale Highlights current state-of-the-art, novel research topics and achievements in the area of molecular modelling and multiscaling problems of electronic materials and their applications as well as atomistic modeling of mechanical properties Provides practical examples for engineers interested in molecular modeling using simulations drawn from electronic packaging, dielectric materials, and thermal and mechanical properties
ISBN: 9783319128627 (electronic bk.)
Standard No.: 10.1007/978-3-319-12862-7doiSubjects--Topical Terms:
592551
Molecules
--Models.
LC Class. No.: QD480
Dewey Class. No.: 541.22
Molecular modeling and multiscaling issues for electronic material applications.. Volume 2
LDR
:03288nam a2200325 a 4500
001
835151
003
DE-He213
005
20150714160005.0
006
m d
007
cr nn 008maaau
008
160421s2015 gw s 0 eng d
020
$a
9783319128627 (electronic bk.)
020
$a
9783319128610 (paper)
024
7
$a
10.1007/978-3-319-12862-7
$2
doi
035
$a
978-3-319-12862-7
040
$a
GP
$c
GP
041
0
$a
eng
050
4
$a
QD480
072
7
$a
TJF
$2
bicssc
072
7
$a
TEC008000
$2
bisacsh
072
7
$a
TEC008070
$2
bisacsh
082
0 4
$a
541.22
$2
23
090
$a
QD480
$b
.M718 2015
245
0 0
$a
Molecular modeling and multiscaling issues for electronic material applications.
$n
Volume 2
$h
[electronic resource] /
$c
edited by Artur Wymyslowski ... [et al.].
260
$a
Cham :
$c
2015.
$b
Springer International Publishing :
$b
Imprint: Springer,
300
$a
x, 194 p. :
$b
ill., digital ;
$c
24 cm.
505
0
$a
Molecular Modeling of pH-Dependent Properties of Emeraldine Base Polyaniline for pH-Based Chemical Sensors -- Two Approaches of Study Cu/Epoxy Interface Enhancement with Benzenethiol Promoter -- Molecular Dynamics Simulation of Pore Formation Mechanism for Deposition of Poly (vinylidene fluoride-co-trifluoroethylene) on Gold Substrate -- Investigating the Influence of Moisture by Molecular Dynamics Simulations -- Analysis of the Adhesion Work with a Molecular Modeling Method and a Wetting Angle Measurement -- Using Coarse-Grained Molecular Models (Molecular-Mesocale) of a Copper Oxide-Epoxy Interface to Obtain Stress-Strain Failure Predictions which Include Interfacial Roughness, Water and Filler Effects -- Establishment of the Mesoscale Parameters for Separation: A Non-Equilibrium Molecular Dynamics Model -- Mechanics of Graphene and Carbon Nanotubes under Uniaxial Compression and Tension -- Analysis of an Influence of a Conversion Level on Simulation Results of the Crosslinked Polymers.
520
$a
This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction. This book also: Discusses multiscale modeling of materials at the mesoscale Highlights current state-of-the-art, novel research topics and achievements in the area of molecular modelling and multiscaling problems of electronic materials and their applications as well as atomistic modeling of mechanical properties Provides practical examples for engineers interested in molecular modeling using simulations drawn from electronic packaging, dielectric materials, and thermal and mechanical properties
650
0
$a
Molecules
$x
Models.
$3
592551
650
0
$a
Electronics
$x
Materials.
$3
641591
650
0
$a
Molecular dynamics.
$3
580431
650
0
$a
Materials science.
$3
557839
650
1 4
$a
Engineering.
$3
561152
650
2 4
$a
Electronics and Microelectronics, Instrumentation.
$3
670219
650
2 4
$a
Continuum Mechanics and Mechanics of Materials.
$3
670886
650
2 4
$a
Optical and Electronic Materials.
$3
593919
650
2 4
$a
Nanoscale Science and Technology.
$3
783795
700
1
$a
Wymyslowski, Artur.
$3
1064189
710
2
$a
SpringerLink (Online service)
$3
593884
773
0
$t
Springer eBooks
856
4 0
$u
http://dx.doi.org/10.1007/978-3-319-12862-7
950
$a
Engineering (Springer-11647)
based on 0 review(s)
Multimedia
Reviews
Add a review
and share your thoughts with other readers
Export
pickup library
Processing
...
Change password
Login