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Three-dimensional integration of semiconductors = processing, materials, and applications /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Three-dimensional integration of semiconductors/ edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi.
其他題名:	processing, materials, and applications /
其他作者:	Kondo, Kazuo.
出版者:	Cham :Springer International Publishing : : 2015.,
面頁冊數:	xix, 408 p. :ill., digital ; : 24 cm.;
Contained By:	Springer eBooks
標題:	Semiconductors. -
電子資源:	http://dx.doi.org/10.1007/978-3-319-18675-7
ISBN:	9783319186757

Three-dimensional integration of semiconductors = processing, materials, and applications /
Three-dimensional integration of semiconductorsprocessing, materials, and applications /[electronic resource] :edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi. - Cham :Springer International Publishing :2015. - xix, 408 p. :ill., digital ;24 cm.

Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET.

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

ISBN: 9783319186757

Standard No.: 10.1007/978-3-319-18675-7doiSubjects--Topical Terms:

578843
Semiconductors.

LC Class. No.: TK7874.893

Dewey Class. No.: 621.38152

Three-dimensional integration of semiconductors = processing, materials, and applications /
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505 0 $a Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET.
520 $a This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
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