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Designing TSVs for 3D integrated cir...
~
Khan, Nauman.
Designing TSVs for 3D integrated circuits
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Designing TSVs for 3D integrated circuits/ by Nauman Khan, Soha Hassoun.
作者:
Khan, Nauman.
其他作者:
Hassoun, Soha.
出版者:
New York, NY :Springer New York : : 2013.,
面頁冊數:
x, 76 p. :ill., digital ; : 24 cm.;
Contained By:
Springer eBooks
標題:
Three-dimensional integrated circuits - Design. -
電子資源:
http://dx.doi.org/10.1007/978-1-4614-5508-0
ISBN:
9781461455080 (electronic bk.)
Designing TSVs for 3D integrated circuits
Khan, Nauman.
Designing TSVs for 3D integrated circuits
[electronic resource] /by Nauman Khan, Soha Hassoun. - New York, NY :Springer New York :2013. - x, 76 p. :ill., digital ;24 cm. - SpringerBriefs in electrical and computer engineering,2191-8112. - SpringerBriefs in electrical and computer engineering..
ISBN: 9781461455080 (electronic bk.)Subjects--Topical Terms:
1071849
Three-dimensional integrated circuits
--Design.
LC Class. No.: TK7874.893 / .K43 2013
Dewey Class. No.: 621.395
Designing TSVs for 3D integrated circuits
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